Chip carrier with reduced interference signal sensitivity

1. A carrier for microelectronic devices and/or circuits comprising:

a substrate having a first interface with a plurality of first contact holes, a second interface, which essentially lies opposite the first interface, with a plurality of second contact holes, a substrate body, and a plurality of electrically conductive contact channels formed in the substrate body, wherein each of the contact channels electrically conductively connects a first contact hole to a second contact hole; and

at least one front-side wiring layer arranged on the first interface and having formed therein at least one first front-side metallization layer at least partly comprising a first capacitor electrode configured to electrically connect the microelectronic devices and/or circuits to a first pole of a signal or supply voltage; and

a rear-side wiring layer arranged at the second interface and having formed therein at least one first rear-side metallization layer which at least partly comprises a second capacitor electrode,

wherein the first capacitor electrode and/or the second capacitor electrode comprises a plurality of first and/or second capacitor fingers, respectively, formed by a plurality of the contact channels which are electrically conductively connected to the first front-side metallization layer and/or the first rear-side metallization layer, respectively,

wherein the first front-side metallization layer and/or the first rear-side metallization layer are/is spaced apart from the first and/or second interface, respectively, at least in regions by a capacitor dielectric, and

wherein the first capacitor electrode, at least partly via the capacitor dielectric formed in the carrier and/or via electrically conductive regions of the substrate, couples capacitively to the second capacitor electrode which electrically connects the microelectronic devices and/or circuits to a second pole of the signal or supply voltage.

2. The carrier as claimed in claim 1 , wherein the first capacitor electrode and/or the second capacitor electrode forms a first and/or second supply electrode, respectively, for electrically connecting the microelectronic devices and/or circuits to a first and/or second pole, respectively, of a supply voltage.

3. The carrier as claimed in claim 1 , wherein in the first front-side metallization layer and/or the first rear-side metallization layer there is formed at least one front-side and/or rear-side interconnect, respectively, which is electrically conductively connected to at least one contact channel.

4. The carrier as claimed in claim 3 , wherein the first capacitor electrode comprises essentially the entire area not used for interconnects and/or plated-through holes in the first front-side metallization layer.

5. The carrier as claimed in claim 1 , wherein the substrate body at least partly comprises electrically conductively doped silicon.

6. The carrier as claimed claim 1 , wherein the capacitor dielectric comprises an insulator having a high dielectric constant.

7. The carrier as claimed claim 6 , wherein the insulator is at least one of TiO 2 , Al 2 O 3 , Ta 2 O 5 , HfO 2 , Si 3 N 4 , an ONO layer structure, and a SiO 2 /Si 3 N 4 /SiO 2 layer structure.

8. The carrier as claimed in claim 1 , wherein the electrical capacitance formed per area in the carrier between the first capacitor electrode and the second capacitor electrode is at least partly greater than 500 pF/mm 2 .

9. The carrier as claimed in claim 1 , wherein the electrical capacitance formed per area in the carrier between the first capacitor electrode and the second capacitor electrode is at least partly greater than 1 nF/mm 2 .

10. The carrier as claimed in claim 1 , wherein the electrical capacitance formed per area in the carrier between the first capacitor electrode and the second capacitor electrode is at least partly greater than 3 nF/mm 2 .

11. The carrier as claimed in claim 1 , wherein the electrical capacitance formed in the carrier between the first capacitor electrode and the second capacitor electrode is greater than 50 nF.

12. The carrier as claimed in claim 1 , wherein the electrical capacitance formed in the carrier between the first capacitor electrode and the second capacitor electrode is greater than 100 nF.

13. The carrier as claimed in claim 1 , wherein the electrical capacitance formed in the carrier between the first capacitor electrode and the second capacitor electrode is greater than 300 nF.

14. The carrier as claimed in claim 1 , wherein the plurality of first capacitor fingers are spaced apart from and electrically insulated from the substrate body by the capacitor dielectric.

15. The carrier as claimed in claim 1 , wherein the plurality of second capacitor fingers are spaced apart from and electrically insulated from the substrate body by the capacitor dielectric.

16. The carrier as claimed in claim 1 , wherein the capacitive coupling between the first and the second capacitor electrode is effected via the substrate body.

17. The carrier as claimed in claim 1 , wherein the second capacitor electrode at least partly comprises the substrate body.

18. The carrier as claimed in claim 1 , wherein the second capacitor electrode is at least partly comprised by a second front-side metallization layer which is formed in the front-side wiring layer and which is at least partly spaced apart from the first front-side metallization layer by the capacitor dielectric.

19. The carrier as claimed in claim 1 , wherein inductances are formed in at least one of the metallization layers.

20. The carrier as claimed in claim 1 , wherein the at least one front-side wiring layer further comprises a third front-side metallization layer.