Method of making circuitized substrate with split conductive layer and information handling system utilizing same
View Patent ↗A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.
1. A method of making a circuitized substrate, said method comprising:
providing at least one electrically conductive layer of substantially planar configuration and having first and second opposing surfaces, said at least one electrically conductive layer including at least two separate, electrically isolated portions, each electrically isolated portion including an edge portion substantially facing an edge portion of at least one other electrically isolated portion, each of said edge portions facing each other comprised of a plurality of contiguous formed open segments;
positioning a first dielectric layer on said first opposing surface of said at least one electrically conductive layer such that a portion of said first dielectric layer is also positioned within selected ones of said contiguous formed open segments of each of said facing edge portions;
providing a plurality of openings within said first dielectric layer which are each aligned above a respective one of the remaining ones of said contiguous formed open segments; and
positioning a second dielectric layer on said second opposing surface of said at least one electrically conductive layer such that a portion of said second dielectric layer is positioned within said remaining ones of said contiguous formed open segments of each of said facing edge portions and within said plurality of openings within said first dielectric layer aligned above said respective ones of said remaining ones of said contiguous formed open segments, only said portion of said first dielectric layer being positioned within said selected ones of said contiguous formed open segments of each of said facing edge portions and substantially only said portion of said second dielectric layer being positioned with said remaining ones of said contiguous formed open segments of each of said facing edge portions and within said plurality of openings within said first dielectric layer aligned above said respective ones of said remaining ones of said contiguous formed open segments, said portions of both of said first and second dielectric layers positioned within said contiguous formed open segments of said facing edge portions providing a common, substantially solid dielectric barrier between said facing edge portions.
2. The method of claim 1 wherein said plurality of contiguous formed open segments are formed by drilling.
3. The method of claim 2 wherein said drilling is accomplished using mechanical drills.
4. The method of claim 2 wherein said drilling is accomplished using a laser.
5. The method of claim 1 wherein said positioning said first dielectric layer on said first opposing surface of said at least one electrically conductive layer and said substantially filling said selected ones of said contiguous formed open segments of said facing edge portions with a portion of said first dielectric layer are accomplished utilizing a lamination process.
6. The method of claim 5 wherein said positioning of said second dielectric layer on said second opposing surface of said at least one electrically conductive layer such that a portion of said second dielectric layer is positioned within said remaining ones of said contiguous formed open segments of each of said facing edge portions and within said plurality of openings within said first dielectric layer aligned above said respective ones of said remaining ones of said contiguous formed open segments are accomplished utilizing a lamination process.
7. The method of claim 1 wherein said at least one electrically conductive layer is provided of copper.
8. The method of claim 1 wherein said first dielectric layer is provided with a resin material as part thereof.
9. The method of claim 1 further including providing reinforcement material as part of said first dielectric layer.
10. The method of claim 9 wherein said reinforcement material is provided as fiberglass.
11. The method of claim 1 wherein said second dielectric layer is provided with a resin material as part thereof.
12. The method of claim 11 further including providing reinforcement material as part of said second dielectric layer.
13. The method of claim 12 wherein said reinforcement material provided as part of said second dielectric layer is provided as fiberglass.