IP Library Granted Patent US 7,632,731
Granted Patent B2
US 7,632,731 · App. 11/645,545 · Granted Dec 15, 2009

Semiconductor device and method for fabricating the same

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Quick Facts
Patent No.
US 7,632,731
App. No.
11/645,545
Granted
Dec 15, 2009
Kind
B2
Abstract

A method of fabricating a semiconductor device consistent with the present invention, the method comprising: forming an insulation film on a substrate; forming a mono-atomic layer of barrier ions at the insulation film; forming a gate insulation film in which the barrier ions are stabilized by an annealing process; forming a gate electrode on the gate insulation film; forming a spacer at a side surface of the gate electrode; and forming source/drain impurity regions at a side surface of the gate electrode.

Claims (12)

1. A method of fabricating a semiconductor device, comprising:

forming an insulating layer on a substrate;

forming a mono-atomic layer of nitride film at the insulating layer;

forming a gate insulating layer by an annealing process immediately after forming the mono-atomic layer of nitride film, wherein the mono-atomic layer of nitride film is penetrated into the insulating layer by the annealing process;

forming a gate electrode on the gate insulating layer;

forming a spacer at a sidewall of the gate electrode; and

forming source/drain impurity regions at a side of the gate electrode.

2. The method according to claim 1 , wherein the insulating layer comprises an oxide layer.

3. The method according to claim 1 , wherein the formation of the insulating layer uses a water vapor generator (WVG) type wet oxidation process.

4. The method according to claim 1 , wherein the formation of the insulating layer is performed at a temperature ranging from about 740 to 760° C. and at a pressure ranging from about 90 to 110 torr for about 2 through 3 minutes, in which N 2 of 4.0˜5.0 slm, H 2 of 0.4˜0.6 slm, and O 2 of 0.4˜0.6 slm are implanted in the insulation film.

5. The method according to claim 1 , wherein the mono-atomic layer of nitride film is formed by an atomic layer deposition (ALD) process.

6. The method according to claim 1 , wherein the annealing process is achieved at a temperature ranging from about 1050 to 1150° C. and at a pressure ranging from about 4 to 110 torr for about 10 through 20 seconds.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
CHANGE OF NAME Recorded Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
MERGER AND CHANGE OF NAME Recorded Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →