Method of manufacturing high-voltage semiconductor device and low-voltage semiconductor device
View Patent ↗A high-voltage semiconductor device and a method for making the same are provided. A high-voltage semiconductor device and a low-voltage semiconductor device are formed in a single substrate, a photolithography process that is required to form a high-voltage well region is omitted, and the well region of the high-voltage semiconductor is formed together with the well region of the low-voltage semiconductor device formed in another photolithography process.
1. A method of manufacturing a high-voltage semiconductor device, the high-voltage semiconductor device being formed together with a low-voltage semiconductor device in a single wafer, the method comprising the steps of:
preparing a semiconductor substrate;
forming device isolation layers in the semiconductor substrate;
forming a well region of the high-voltage semiconductor device by performing a first ion implantation process on the semiconductor substrate using an optical mask having both a first pattern for forming a well region of the low-voltage semiconductor device and a second pattern for forming the well region of the high-voltage semiconductor device;
forming drift regions in the well regions by performing a second ion implantation process on the semiconductor substrate, the second ion implantation process comprising a primary ion implantation process of implanting N-type dopants at high energy, and a secondary ion implantation process of implanting N-type dopants at intermediate energy; and
annealing the semiconductor substrate.
2. The method of claim 1 , wherein the first and second ion implantation processes are performed such that a concentration of dopants in the drift regions is lower than that of dopants in the well region in junction regions between the drift regions and the well region.
3. The method of claim 1 , wherein the N-type dopants are boron, and the high energy is 480 KeV.
4. The method of claim 1 , wherein the well regions are formed such that a region thereof having a highest concentration is located in the substrate, and dopants have a retrograde distribution in a range from a location having the highest concentration to a surface of the substrate.
5. The method of claim 1 , wherein the primary and secondary ion implantation processes are performed using an identical drift pattern.
6. A method of manufacturing a high-voltage semiconductor device, the high-voltage semiconductor device being formed together with a low-voltage semiconductor device in a single wafer, the method comprising the steps of:
preparing a semiconductor substrate;
forming device isolation layers in the semiconductor substrate;
forming a well region of the high-voltage semiconductor device by performing a first ion implantation process on the semiconductor substrate using an optical mask having both a first pattern for forming a well region of the low-voltage semiconductor device and a second pattern for forming the well region of the high-voltage semiconductor device;
forming drift regions in the well regions by performing a second ion implantation process on the semiconductor substrate, the second ion implantation process comprising a primary ion implantation process of implanting P-type dopants at intermediate energy, and a secondary ion implantation process of implanting P-type dopants at intermediate energy; and
annealing the semiconductor substrate.
7. The method of claim 6 wherein the P-type dopants are boron, and the intermediate energy is 180 KeV.
8. The method of claim 6 , wherein the primary and secondary ion implantation processes are performed using an identical drift pattern.
9. The method of claim 6 , wherein the first and second ion implantation processes are performed such that a concentration of dopants in the drift regions is lower than that of dopants in the well region in junction regions between the drift regions and the well region.
10. The method of claim 6 , wherein the well regions are formed such that a region thereof having a highest concentration is located in the substrate, and dopants have a retrograde distribution in a range from a location having the highest concentration to a surface of the substrate.