Semiconductor device with a bulb-type recess gate
View Patent ↗When a recess of a bulb-type recess gate is formed, the recess formed in a device isolation region is formed to be separated from an edge of an active region. This structure thereby prevents damage of a semiconductor substrate of the edge of the active region and a defect during a Self Alignment Contact (SAC) process. As a result, characteristics and yield of devices improve.
1. A method for manufacturing a semiconductor device, comprising the steps of:
forming a photoresist film over a semiconductor substrate including a device isolation region and an active region;
performing a lithography process using an exposure mask to form a photoresist pattern; and
patterning the semiconductor substrate using the photoresist pattern as a mask to form a bulb type recess in the active region and a recess in the device isolation region, wherein a line width of the recess in the device isolation region is smaller than a line width of the bulb-type recess in the active region.
2. The method according to claim 1 , wherein the device isolation film comprises an oxide film and the semiconductor substrate comprises silicon.
3. The method according to claim 1 , wherein the recess formed in the device isolation region is separated from the edge of the active region by a given distance.
4. The method according to claim 1 , wherein the bulb-type recess is formed by an isotropic etching process.
5. The method according to claim 1 , further comprising forming a gate oxide film having a given thickness over the semiconductor substrate including the bulb-type recess.
6. The method according to claim 1 , further comprising forming a deposition structure including a gate polysilicon layer, a gate metal layer and a gate hard mask layer to fill the bulb-type recess.
7. The method according to claim 1 , further comprising forming a gate structure on both recesses in the active region and the isolation region.
8. The method according to claim 7 , wherein the forming-a-gate-structure is performed using the exposure mask, wherein the exposure mask comprises:
a plurality of active region patterns; and
a plurality of recess patterns with a first line width, passing across the active region patterns, wherein the line width of at least one of the plurality of recess patterns neighboring one of the plurality of active region patterns is narrowed down into a second line width.