Apparatus and Method For Wet Treatment of Wafers
Disclosed is a device for wet treatment of disk-like substrates comprising a first plate ( 10 ) with a size and shape being able to overlap a disk-like substrate to be treated, holding means ( 22 ) for holding a disk-like substrate (W) parallel to said first plate in a s distance of 0.2 to 5 mm, rotating means ( 37 ) for rotating the disk-like substrate (W) about a rotation axis (A) substantially perpendicular to said first plate, first dispensing means ( 14 ) with a first dispensing opening ( 16 ) in the first gap for introducing fluid into a first gap ( 11 ) between said first plate ( 10 ) and a disk-like substrate (W) when being treated, and shifting means ( 34 ) for shifting the position of said first dispensing opening ( 16 ) from a first position (P 1 ) to a second position (P 2 ) wherein the distance of said first position (P 1 ) to the rotation axis (A) is smaller than the distance of said second position (P 2 ) to the rotation axis (A). Furthermore an associated method is disclosed.
1 . Device for wet treatment of disk-like substrates comprising
a first plate ( 10 ) with a size and shape being able to overlap a disk-like substrate to be treated
holding means ( 22 ) for holding a disk-like substrate (W) parallel to said first plate in a distance of 0.2 to 5 mm
rotating means ( 37 ) for rotating the disk-like substrate (W) about a rotation axis (A) substantially perpendicular to said first plate
first dispensing means ( 14 ) with a first dispensing opening ( 16 ) in the first gap for introducing fluid into a first gap ( 11 ) between said first plate ( 10 ) and a disk-like substrate (W) when being treated
shifting means ( 34 ) for shifting the position of said first dispensing opening ( 16 ) with respect to the rotation axis (A) from a first position (P 1 ) to a second position (P 2 ) wherein the distance of said first position (P 1 ) to the rotation axis (A) is smaller than the distance of said second position (P 2 ) to the rotation axis (A).
2 . Device according to claim 1 wherein said first dispensing opening ( 16 ) when being in said first position (P 1 ) includes the rotation axis whereas it does not include said rotation axis (A) in said second position (P 2 ).
3 . Device according to claim 1 further comprising a second plate ( 20 ) substantially parallel to said first plate ( 10 ) so that a chamber is provided by the two plates in order to receive a disk-like substrate to be treated therein.
4 . Device according to claim 2 further comprising second dispensing means ( 24 ) for introducing fluid into a second gap between said second plate and a disk-like substrate when being treated.
5 . Device according to claim 2 further comprising at least one vibrating element ( 18 ) acoustically coupled to at least said first plate ( 10 ).
6 . Device according to claim 2 wherein said holding means ( 22 ) and said second plate ( 20 ) are coupled to each other to form a rotatable holding unit.
7 . Method for wet treatment of a disk-like substrate
placing a disk-like substrate to be treated parallel to a first plate in a distance of 0.2 to 5 mm
rotating the disk-like substrate (W) about a rotation axis (A) substantially perpendicular to said first plate
inserting a first liquid through a first dispensing opening ( 16 ) into said first gap thereby substantially completely filling said first gap
shifting the position of said first dispensing opening ( 16 ) with respect to the rotation axis (A) from a first position (P 1 ) to a second position (P 2 ) wherein the distance of said first position (P 1 ) to the rotation axis (A) is smaller than the distance of said second position (P 2 ) to the rotation axis (A).
8 . Method according to claim 7 wherein said first dispensing opening ( 16 ) when being in said first position (P 1 ) includes the rotation axis whereas it does not include said rotation axis (A) in said second position (P 2 ).
9 . Method according to claim 7 wherein one treatment step is carried out when said first dispensing opening is at the first position (P 1 ) and another treatment step is carried out when said first dispensing opening is at the second position (P 2 ).
10 . Method according to claim 7 wherein a first treatment step is carried out when said first dispensing opening is at the first position (P 1 ) and a subsequent treatment step is carried out when said first dispensing opening is at the second position (P 2 ).
11 . Method according to claim 7 wherein ultrasonic energy is applied to the disk-like substrate during at least a time sequence during the disk-like substrate treatment.
12 . Method according to claim 11 wherein the position of said first dispensing opening ( 16 ) is shifted with respect to the rotation axis (A) during at least a time sequence when ultrasonic energy is applied to the substrate.