IP Library Granted Patent US 7,519,890
Granted Patent B2
US 7,519,890 · App. 11/676,070 · Granted Apr 14, 2009

Input/output circuit for handling unconnected I/O pads

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Quick Facts
Patent No.
US 7,519,890
App. No.
11/676,070
Granted
Apr 14, 2009
Kind
B2
Abstract

A method based on a circuit coupled to an input-output bond pad (I/O pad) in an integrated circuit including an input buffer, an output buffer and a pad management circuit. The pad management circuit receives a first data signal, a first output enable signal, and a configuration signal indicative of the connection state of the I/O pad, and generates a second data signal and a second output enable signal. When the configuration signal indicates the I/O pad is to be connected to a package pin, the pad management circuit couples the first data signal as the second data signal and couples the first output enable signal as the second output enable signal. When the configuration signal indicates the I/O pad is to be left unconnected, the pad management circuit asserts the second output enable signal and generates the second data signal having a predetermined value.

Claims (10)

1. A method for an input-output bond pad (I/O pad) in an integrated circuit, the I/O pad being coupled to an I/O circuit comprising an input buffer and an output buffer, the method comprising:

determining a connection state of the I/O pad;

when the connection state indicates an unconnected mode where the I/O pad is to be left unconnected in an integrated circuit package, activating the output buffer and driving the I/O pad to a first data value; and

when the connection state indicates a normal mode where the I/O pad is to be connected in the integrated circuit package, driving the I/O pad in accordance with the normal operation of the integrated circuit.

2. The method of claim 1 , wherein the first data value comprises a predetermined value that is compatible with the operation of the integrated circuit.

3. The method of claim 2 , wherein the first data value comprises a fixed data value.

4. The method of claim 2 , wherein the first data value comprises a data value that varies according to the operation of the integrated circuit.

5. The method of claim 1 , wherein activating the output buffer comprises asserting an output enable signal controlling the output buffer to turn on the output buffer.

6. The method of claim 1 , wherein driving the I/O pad to a first data value comprises driving the input buffer by providing the first data value as an output signal.

7. The method of claim 1 , wherein determining the connection state of the I/O pad comprises storing configuration information of the integrated circuit and providing the configuration information to the I/O circuit for determining the connection state of the I/O pad.

Assignments (9)
INTELLECTUAL PROPERTY BUY-IN AGREEMENT/ASSIGNMENT Recorded Apr 4, 2023
From: MICREL LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 063241/0771 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →