Plasma processing apparatus and plasma processing method
View Patent ↗A plasma processing apparatus having a processing chamber and a sample base, and processing a sample by using plasma generated inside the processing chamber, the processing chamber being located inside a vacuum container, the sample base being located inside the processing chamber, the sample being mounted on the sample base, the plasma processing apparatus including a component member configuring inner-side wall surface of the processing chamber, and having a dielectric portion on the inner-side wall surface, an exhaustion unit for exhausting the inside of the processing chamber, and an electric-field supply unit for supplying an electric field to the component member in a state where the plasma will not be generated inside the processing chamber, wherein magnitude of the electric field supplied from the electric-field supply unit is changed rapidly while exhausting the inside of the processing chamber by the exhaustion unit.
1. A plasma processing method comprising the steps of:
locating a sample inside a processing chamber in which a vacuum-processing space is constituted,
processing a layer to be processed which is disposed on a surface of said sample using plasma inside of said processing chamber which is generated by an electric field from a high-frequency power source, and
supplying and halting supply of high-frequency power into said processing chamber from said high-frequency power source between processing of samples in said processing chamber under a condition that no plasma is generated inside said processing chamber while exhausting the inside of said processing chamber.
2. The plasma processing method according to claim 1 , further comprising the steps of:
performing a plasma cleaning of said inside of said processing chamber; and
after said plasma cleaning, performing said supplying and halting supply of said high-frequency power into said processing chamber from said high-frequency power source under said condition that no plasma is generated inside said processing chamber.
3. A plasma processing method according to claim 2 , wherein said high-frequency power is supplied to a wall of said processing chamber facing said vacuum-processing space in which said plasma is generated, and a surface of said wall being covered by a film of dielectric material.
4. A plasma processing method according to claim 1 , wherein said high-frequency power is supplied to a wall of said processing chamber facing said vacuum-processing space in which said plasma is generated, and a surface of said wall being covered by a film of dielectric material.
5. A plasma processing method comprising the steps of:
locating a sample inside a processing chamber in which a vacuum-processing space is constituted;
processing a layer to be processed which is disposed on a surface of the sample using plasma inside of the processing chamber which is generated by an electric field from a high-frequency power source; and
supplying and halting supply of high-frequency power from the high-frequency power source into the processing chamber between processings of samples under a condition of performing no discharge inside of the processing chamber while exhausting the inside of the processing chamber.
6. A plasma processing method according to claim 5 , further comprising the steps of:
performing a plasma cleaning of the inside of the processing chamber; and
after the plasma cleaning from the high-frequency power source, performing the supplying and halting supply of the high-frequency power into the processing chamber under the condition of performing no discharge inside the processing chamber.
7. A plasma processing method according to claim 6 , wherein the high-frequency power is supplied to a wall of the processing chamber facing the vacuum-processing space in which the plasma is generated, and a surface of the wall being covered by a film of dielectric material.
8. A plasma processing method according to claim 5 , wherein the high-frequency power is supplied to a wall of the processing chamber facing the vacuum-processing space in which the plasma is generated, and a surface of the wall being covered by a film of dielectric material.