Integrated circuit package system with mounting features for clearance

1. A method for manufacturing an integrated circuit package comprising:

providing a substrate having a contact pad;

forming a first conductor having a first melting point, a first width, and a first height over the contact pad;

forming a second conductor having a second melting point, a second width, and a second height over the first height of the first conductor with the first melting point higher than the second melting point and the second width less than or substantially equal to the first width;

mounting a first device over the second conductor; and

coupling a second device to a bond pad, in the substrate, adjacent to the contact pad.

2. An integrated circuit package system comprising:

a substrate having a contact pad;

a first conductor having a first melting point, a first width, and a first height over the contact pad;

a second conductor having a second melting point, a second width, and a second height over the first height of the first conductor with the first melting point higher than the second melting and the second width less than or substantially equal to the first width;

a first device over the second conductor; and

a second device coupled to a bond pad, in the substrate, adjacent to the contact pad.

3. The system as claimed in claim 2 wherein the first conductor includes gold, copper, aluminum, silver, metal alloy, or solder.

4. The system as claimed in claim 2 wherein the second conductor includes solder.

5. The system as claimed in claim 2 wherein:

the first device and the substrate have a clearance including the first height and the second height.