Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks
View Patent ↗A method of patterning a substrate comprising first and second fields with a template, the template having a mold and a plurality of alignment forming areas and a plurality of template alignment marks, the method comprising: positioning a material on the first field of the substrate and a plurality of regions of the substrate, the plurality of regions laying outside of the first and second fields; positioning the mold and the substrate such that a desired spatial relationship between the mold and the first field of the substrate is obtained to define a pattern in the material on the first field of the substrate while concurrently defining a plurality of substrate alignment marks with the material in the plurality of regions of the substrate in superimposition with the plurality of alignment forming areas of the template; positioning a material on the second field of the substrate; and positioning the mold and the substrate to obtain a desired spatial relationship between the plurality of template alignment marks and the plurality of substrate alignment marks such that a desired spatial relationship between the mold and the second field of the substrate is obtained to define a pattern in the material on the second field of the substrate.
1. A method of patterning a substrate comprising first and second fields with a template having a plurality of sections, a first section having a mold and a first subset of alignment forming areas and a plurality of template alignment marks defining a first pattern, and a second section having a second subset of alignment forming areas and a plurality of template alignment marks defining a second pattern wherein the first pattern corresponds to the second pattern, said method comprising:
positioning a material on said first field of said substrate and a plurality of regions of said substrate, said plurality of regions laying outside of said first and second fields;
positioning said mold and said substrate such that a desired spatial relationship between said mold and said first field of said substrate is obtained to define a pattern in said material on said first field of said substrate while concurrently defining a plurality of substrate alignment marks with said material in said plurality of regions of said substrate in superimposition with said second section of said template;
positioning a material on said second field of said substrate; and
positioning said mold and said substrate to obtain a desired spatial relationship between said first subset of template alignment marks and said plurality of substrate alignment marks such that a desired spatial relationship between said mold and said second field of said substrate is obtained to define a pattern in said material on said second field of said substrate.
2. The method as recited in claim 1 wherein said template alignment marks comprise grating alignment marks and said substrate alignment marks comprise checkerboard alignment marks.
3. The method as recited in claim 1 wherein said plurality of alignment forming areas of said template are positioned on a plurality of mesas on said template.
4. The method as recited in claim 3 wherein said template comprises a first surface and a second surface positioned opposite to said first surface, with said mold extending from said second surface a first distance and a subset of said plurality of mesas extending from said second surface a second distance, with said first distance being substantially equal to said second distance.
5. The method as recited in claim 1 wherein said plurality of template alignment marks of said template are positioned on a plurality of mesas on said template.
6. The method as recited in claim 5 wherein said template comprises a first surface and a second surface positioned opposite to said first surface, with said mold extending from said second surface a first distance and a subset of said plurality of mesas extending from said second surface a second distance, with said first distance being greater than said second distance.
7. The method as recited in claim 1 wherein said template further comprises a plurality of non patterned mesas, wherein positioning said material further comprising positioning a material in areas of said substrate in superimposition with said plurality of non-patterned mesas.
8. The method as recited in claim 1 wherein said substrate has a thickness in a range of 0.05 mm to 8 mm.
9. The method as recited in claim 1 wherein said substrate has a flatness less than 100 nm.
10. The method as recited in claim 1 wherein said substrate and said template comprise substantially the same composition, with said composition being selected from a set of compositions consisting of fused silica and ultra-low-expansion glass.
11. The method as recited in claim 1 wherein a difference in temperature between said substrate and said template is less than 2° C.
12. The method as recited in claim 1 wherein obtaining said desired spatial relationship between said first region and said mold further comprises positioning said mold and said substrate such that said mold is in superimposition with said first region of said substrate.
13. The method as recited in claim 1 wherein obtaining said desired spatial relationship between said second region and said mold further comprises positioning said mold and said substrate such that said mold is in superimposition with said second region of said substrate.
14. The method as recited in claim 1 further comprises coupling said template to a shape modulating chuck.
15. The method as recited in claim 1 further comprises coupling said substrate to a shape modulating chuck.
16. The method as recited in claim 1 further comprises altering a shape of said template via an actuation system coupled thereto.
17. The method as recited in claim 1 further comprises altering a shape of said substrate via an actuation system coupled thereto.
18. The method as recited in claim 1 wherein said substrate further comprises a plurality of fields.