Direct facility water test head cooling architecture

1. An apparatus for cooling an instrument in a semiconductor device test head comprising: an air chamber, wherein the air chamber further comprises an air chamber inlet and an air chamber outlet; a first base configured to receive and removably mount the instrument within the air chamber so that the instrument is exposed to the air chamber, and wherein the first base includes a first base inlet and a first base outlet; a test head inlet in fluid communication with the first base inlet and wherein the test head inlet is in fluid communication with a facility water supply; means for preheating the facility water supply that enters test head inlet; a test head discharge in fluid communication with the first base outlet and wherein the test head discharge is in fluid communication with a facility drain; and a fan in fluid communication with the air chamber inlet, wherein the fan is configured to induce the flow of air from the air chamber inlet to the air chamber outlet.

2. The apparatus of claim 1 , further comprising a supply manifold interposed between the test head inlet and the first base inlet and a return manifold interposed between the first base outlet and the test head discharge.

3. The apparatus of claim 1 , further comprising a filter interposed between the facility water supply and the test head inlet, wherein the filter is configured to remove particles as small as 10 microns in diameter.