Nitride semiconductor material, semiconductor element, and manufacturing method thereof
View Patent ↗The nitride semiconductor material according to the present invention includes a group III nitride semiconductor and a group IV nitride formed on the group III nitride semiconductor, where an interface between the group III nitride semiconductor and the group IV nitride has a regular atomic arrangement. Moreover, an arrangement of nitrogen atoms of the group IV nitride in the interface and an arrangement of group III atoms of the group III nitride semiconductor in the interface may be substantially identical.
1. A nitride semiconductor material comprising:
a group III nitride semiconductor; and
a group IV nitride formed on said group III nitride semiconductor, wherein
an interface between said group III nitride semiconductor and said group IV nitride has a regular atomic arrangement;
in said group III nitride semiconductor, an electrical conduction is a p-type;
a lattice constant of said group IV nitride is small compared to a lattice match condition with said group III nitride semiconductor;
in said group IV nitride, a hole which reaches the interface is formed; and
said nitride semiconductor material further includes a conductive material connected with the interface via the hole.
2. The nitride semiconductor material according to claim 1 ,
wherein an arrangement of nitrogen atoms of said group IV nitride in the interface and an arrangement of group III atoms of said group III nitride semiconductor in the interface are substantially identical.
3. The nitride semiconductor material according to claim 1 ,
wherein said group IV nitride semiconductor has a beta-phase or a gamma-phase crystal structure in the interface.
4. The nitride semiconductor material according to claim 1 ,
wherein said group III nitride semiconductor has a (0001) plane of a wurtzite structure or a (111) plane of a zinc-blende structure in the interface,
said group IV nitride has a (0001) plane of a beta-phase crystal structure in the interface,
a <11-20>direction of the (0001) plane of the wurtzite structure or a <11-2>direction of the (111) plane of the zinc-blende structure of said group III nitride semiconductor matches with a <11-20>direction of the (0001) plane of the beta-phase crystal structure of said group IV nitride, and
a lattice constant of said group IV nitride is roughly twice a lattice constant of said group III nitride semiconductor.
5. The nitride semiconductor material according to claim 1 ,
wherein said group III nitride semiconductor has a (0001) plane of a wurtzite structure or a (111) plane of a zinc-blende structure in the interface,
said group IV nitride has a (111) plane of a gamma-phase crystal structure in the interface,
a <11-20>direction of the (0001) plane of the wurtzite structure or a <11-2>direction of the (111) plane of the zinc-blende structure of said group III nitride semiconductor matches with a <11-2>direction of the (111) plane of the gamma-phase crystal structure of said group IV nitride, and
a lattice constant of said group IV nitride is roughly four times a lattice constant of said group III nitride semiconductor.
6. The nitride semiconductor material according to claim 1
wherein said group III nitride semiconductor has a (001) plane of the zinc-blende structure in the interface, and
said group IV nitride has a (001) plane of the gamma-phase crystal structure in the interface.
7. The nitride semiconductor material according to claim 1 ,
wherein said group III nitride semiconductor has a (0001) plane of a wurtzite structure or a (111) plane of a zinc-blende structure in the interface,
said group IV nitride has a (1-100) plane of a beta-phase crystal structure in the interface, and
a <0001>direction of said group IV nitride in the interface is parallel to the interface.
8. The nitride semiconductor material according to claim 1 ,
wherein said group III nitride semiconductor includes:
a first layer made of gallium nitride; and
a second layer formed on said first layer, and made of a group III nitride semiconductor having a wide band gap compared to gallium nitride, and
said group IV nitride is formed on said second layer.
9. The nitride semiconductor material according to claim 1 ,
wherein, in said group III nitride semiconductor, a trench is formed along an in-plane direction in the interface.
10. The nitride semiconductor material according to claim 1 ,
wherein a trench is formed on a top surface of said group IV nitride, along an in-plane direction.
11. The nitride semiconductor material according to claim 1 , further comprising
a second group IV nitride formed on said group IV nitride, which is different in composition from said group IV nitride.
12. The nitride semiconductor material according to claim 11 ,
wherein said group IV nitride is formed with a composition of a group IV element that does not impart strain-induced stress on said group III nitride semiconductor in the interface, and
in said second group IV nitride, the composition is modulated to impart strain-induced stress on the interface in a vertical direction.
13. The nitride semiconductor material according to claim 1 ,
wherein, said group IV nitride contains a group IV element and nitrogen in a 3:4ratio, and having a margin of error that is within 10 percent for composition of the group IV element and the nitrogen.
14. The nitride semiconductor material according to claim 1 ,
wherein said group IV nitride contains hydrogen.
15. The nitride semiconductor material according to claim 1 ,
wherein said group IV nitride semiconductor has a regular atomic arrangement throughout a whole area of said group IV nitride semiconductor.
16. The nitride semiconductor material according to claim 1 , further comprising a second group III nitride semiconductor formed on said group IV nitride,
wherein an interface between said second group III nitride semiconductor and said group IV nitride has a regular atomic arrangement.