Integrated circuit package system with device cavity
View Patent ↗An integrated circuit package system is provided including connecting an integrated circuit die with an external interconnect, forming a first encapsulation having a device cavity with the integrated circuit die therein, mounting a device in the device cavity over the integrated circuit die, and forming a cover over the device and the first encapsulation.
1. A method of manufacturing an integrated circuit package system comprising:
connecting an integrated circuit die, having a non-active side, with an external interconnect;
forming a first encapsulation having a device cavity with the integrated circuit die in the device cavity exposing the non-active side;
mounting a device in the device cavity over the integrated circuit die; and
forming a cover over the device and having a non-horizontal cover side facing a non-horizontal encapsulation side of the first encapsulation.
2. The method as claimed in claim 1 wherein forming the first encapsulation having the device cavity with the integrated circuit die in the device cavity includes:
forming the first encapsulation with the integrated circuit die therein; and
forming the device cavity by thinning the integrated circuit die.
3. The method as claimed in claim 1 wherein forming the cover includes forming a second encapsulation that fills the device cavity.
4. The method as claimed in claim 1 wherein forming the cover includes forming an optical cover.
5. The method as claimed in claim 1 wherein:
forming the device includes:
forming a pad; and
forming the first encapsulation further includes:
forming a recess in the first encapsulation with the pad exposed by a recess.
6. A method of manufacturing an integrated circuit package system comprising:
connecting a first integrated circuit die, having an active side and a non-active side, with an external interconnect;
forming a first encapsulation having a device cavity with the first integrated circuit die in the device cavity exposing the non-active side;
mounting a first device in the device cavity over the non-active side;
connecting the first device with the external interconnect; and
forming a cover over the first device and having a non-horizontal cover side facing a non-horizontal encapsulation side of the first encapsulation to define a package encapsulation.
7. The method as claimed in claim 6 further comprising mounting a second integrated circuit die over the active side of the first integrated circuit die.
8. The method as claimed in claim 6 further comprising mounting a second device over the first device.
9. The method as claimed in claim 6 further comprising:
forming a backside element on the non-active side of the first integrated circuit die;
wherein forming the first encapsulation having the device cavity with the first integrated circuit die in the device cavity includes:
forming the first encapsulation with the first integrated circuit die and the backside element therein; and
forming the device cavity by removing the backside element.
10. The method as claimed in claim 6 further comprising:
attaching a tape on the non-active side of the first integrated circuit die;
wherein forming the first encapsulation having the device cavity with the first integrated circuit die in the device cavity includes:
forming the first encapsulation with the first integrated circuit die attached to the tape; and
forming the device cavity by removing the tape.