Wafer inspection system and method

1. An inspection system comprising:

an edge defect detection unit configured to detect defects occurring in an edge area of a wafer and to record edge defect positions into a coordinate system;

an optical inspection unit configured to capture images of functional devices in a functional area of the wafer that is surrounded by the edge area and to record device defect positions related to the functional devices into the coordinate system; and

a processor unit configured to output a data set relating the edge and device defect positions to the same coordinate system.

2. The inspection system of claim 1 , comprising wherein the data set is configured to relate the device defect positions to the device coordinate system identifying a respective functional device and a position referenced to the respective functional device.

3. The inspection system of claim 2 , comprising wherein the processor unit is configured to transform the edge defect positions into the device coordinate system.

4. The inspection system of claim 2 , comprising wherein the processor unit is further configured to map the edge defect positions to virtual devices, each virtual device being assigned to a sub-region of the edge area that is aligned to a grid to which the functional devices are aligned along both planar dimensions.

5. The inspection system of claim 1 , further comprising:

a rotable support unit configured to align the wafer to the optical inspection device; and

wherein the edge defect detection unit is further configured to inspect the edge area during the alignment.

6. The inspection system of claim 1 , comprising wherein the optical inspection unit is further configured to detect defects via comparing the captured images against each other or against reference images.

7. The inspection system of claim 1 , comprising wherein the edge defect detection unit is further configured to inspect the edge area of a successor wafer during the optical inspection of an antecessor wafer.

8. The inspection system of claim 1 , comprising wherein the edge area overlaps the functional area.

9. A wafer inspection method comprising:

detecting defects occurring in an edge area of the wafer;

recording edge defect positions related to the detected defects into a coordinate system;

capturing images of functional devices in a functional area of the wafer that is surrounded by the edge area;

recording device defect positions related to the functional devices into a coordinate system; and

compiling a data set including the edge and device defect positions, wherein the edge and device defect positions are related to the same coordinate system.

10. The inspection method of claim 9 , wherein the device defect positions are related to the device coordinate system identifying a respective functional device and a position referenced to the respective functional device.

11. The inspection method of claim 10 , comprising transforming the edge defect positions into the device coordinate system.

12. The inspection method of claim 11 , comprising assigning the edge defect positions to virtual devices, wherein each virtual device is assigned to a sub-region of the edge area that is aligned to a grid to which the functional devices in the functional area are aligned along both planar dimensions.

13. The inspection method of claim 9 , comprising inspecting the edge area during alignment of the wafer to the optical inspection device.

14. The inspection method of claim 9 , comprising detecting defects in the functional area by comparing the captured images against each other or against reference images.

15. The inspection method of claim 9 , wherein the edge area of a successor wafer is inspected during the optical inspection of an antecessor wafer.

16. The inspection method of claim 9 , comprising wherein the edge area overlaps the functional area.

17. The inspection method of claim 10 , comprising evaluating in course of the edge error detection, lithographic alignment marks for aligning the edge defect positions to the device coordinate system.

18. A computer program product comprising:

a computer storage medium; and

a computer code mechanism embedded in the computer storage medium and comprising:

a compiler code device configured to compile, from edge defects positions of edge defects occurring in an edge area of a wafer and from device defect positions related to defects occurring in a functional area of the wafer, a data set that includes the edge and device defect positions referenced to a coordinate system.

19. The computer program product of claim 18 , comprising wherein the compiler code device is configured to relate the device defect positions to the device coordinate system that identifies the respective functional device and a position referenced to the respective functional device.

20. The computer program product of claim 19 , comprising wherein the compiler code device is further configured to assign the edge defect positions to virtual devices, each virtual device being assigned to a sub-region of the edge area, each sub-region being aligned to a grid to which the functional devices are aligned along both planar dimensions.

21. A wafer inspection system comprising:

edge defect detection means for detecting defects occurring in an edge area of the wafer and for recording edge defect positions into a coordinate system;

optical inspection means for capturing images of functional device in a functional area of the wafer that is surrounded by the edge area and for recording device defect positions related to the functional devices into a coordinate system; and

a processor configured to output a data set relating the edge and device defect positions to the same coordinate system.

22. The wafer inspecting system of claim 21 , comprising wherein the data set is configured to relate the device defect positions to the device coordinate system identifying a respective functional device and a position referenced to the respective functional device.