IP Library Granted Patent US 7,768,780
Granted Patent B2
US 7,768,780 · App. 11/764,551 · Granted Aug 3, 2010

Flow-through cooling for computer systems

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,768,780
App. No.
11/764,551
Granted
Aug 3, 2010
Kind
B2
Abstract

Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

Claims (28)

1. A rack system for housing a plurality of computers, comprising:

a rack assembly configured to support a first stack of computers and a second stack of computers, each computer in the first stack of computers and in the second stack of computers having a front side and a back side opposite the front side, with the back side of each of the first stack of computers facing the back side of each of the second stack of computers; and

a plurality of fan assemblies configured to create an airflow through the first stack of computers and into the second stack of computers, wherein the plurality of fan assemblies comprises:

a first fan assembly in each computer in the first stack of computers, the first fan assembly configured to create an airflow entering the front side and exiting the back side of each computer in the first stack of computers; and

a second fan assembly in each computer in the second stack of computers, the second fan assembly configured to create an airflow entering the back side and exiting the front side of each computer in the second stack of computers.

2. The rack system of claim 1 , wherein:

the first stack of computers and the second stack of computers define a central plenum therebetween.

3. The rack system of claim 1 , wherein:

the plurality of computers comprises a plurality of servers.

4. The rack system of claim 1 , wherein:

the rack assembly measures less than approximately 100″ by approximately 52″ by approximately 38″.

5. A rack system, comprising:

a rack assembly configured to support a first computer and a second computer adjacent to the first computer in a back-to-back configuration, each of the first computer and the second computer having a front side and a back side opposite the front side with the back side of the first computer facing the back side of the second computer; and

at least one fan assembly configured to create an airflow entering the front side and exiting the back side of the first computer, then entering the back side and exiting the front side of the second computer;

wherein the first computer and the second computer define a central plenum therebetween; and

the at least one fan assembly is provided in the central plenum.

6. The rack system of claim 5 , wherein:

the first and second computers comprise servers.

7. The rack system of claim 5 , wherein:

the rack assembly measures less than approximately 100″ by approximately 52″ by approximately 38″.

8. A method of cooling a plurality of computers in a rack system, comprising:

supporting a first stack of computers and a second stack of computers in a rack assembly, each computer in the first stack of computers and in the second stack of computers having a front side and a back side opposite the front side, with the back side of each of the first stack of computers facing the back side of each of the second stack of computers; and

effectuating an airflow through the first stack of computers and into the second stack of computers, said effectuating the airflow comprising:

operating a first fan assembly in each computer in the first stack of computers to create an airflow entering the front side and exiting the back side of each computer in the first stack of computers; and

operating a second fan assembly in each computer in the second stack of computers to create an airflow entering the back side and exiting the front side of each computer in the second stack of computers.

9. The method of claim 8 , wherein:

the plurality of computers comprises a plurality of servers.

10. The method of claim 8 , wherein: the rack assembly measures less than approximately 100″ by approximately 52″ by approximately 38″.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2017
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 044128/0149 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
To: SILICON GRAPHICS INTERNATIONAL CORP.
Reel/Frame 040545/0362 →
SECURITY INTEREST Recorded Mar 13, 2015
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035200/0722 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR AND ASSIGNEE ERROR PREVIOUSLY RECORDED ON REEL 022878 FRAME 0254. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT ASSIGNMENT CONVEYANCE IS FROM RACKABLE SYSTEMS, INC. TO SILICON GRAPHICS INTERNATIONAL CORP. Recorded Jul 13, 2010
From: RACKABLE SYSTEMS, INC.
To: SILICON GRAPHICS INTERNATIONAL CORP.
Reel/Frame 024672/0438 →
MERGER Recorded Jun 26, 2009
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: RACKABLE SYSTEMS, INC.
Reel/Frame 022878/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2007
From: COGLITORE, GIOVANNI; CASEBOLT, MATTHEW P.; WEISICKLE, ROBERT L.
To: RACKABLE SYSTEMS, INC.
Reel/Frame 019981/0675 →