Low cost high density rectifier matrix memory
View Patent ↗A high density memory device is fabricated three dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.
1. An electronic memory device comprising:
a plurality of layers of memory circuitry, wherein each layer of memory circuitry comprises a plurality of storage locations; and
error detection and correction logic interconnected to at least one of the layers of memory circuitry,
wherein the error detection and correction logic is disposed on a substrate disposed beneath the plurality of layers of memory circuitry.
2. The electronic memory device of claim 1 , wherein the substrate comprises a semiconductor material.
3. The electronic memory device of claim 1 , further comprising a microprocessor disposed on the substrate, the microprocessor comprising the error detection and correction logic.
4. An electronic memory device comprising:
a plurality of layers of memory circuitry, wherein each layer of memory circuitry comprises a plurality of storage locations; and
data decryption logic interconnected to at least one of the layers of memory circuitry,
wherein the data decryption logic is disposed on a substrate disposed beneath the plurality of layers of memory circuitry.
5. The electronic memory device of claim 4 , wherein the substrate comprises a semiconductor material.
6. The electronic memory device of claim 4 , further comprising a microprocessor disposed on the substrate, the microprocessor comprising the data decryption logic.
7. The electronic memory device of claim 4 , wherein the data decryption logic comprises data encryption circuitry.
8. The electronic memory device of claim 4 , wherein the data decryption logic utilizes a DES algorithm.
9. The electronic memory device of claim 4 , wherein the data decryption logic utilizes a PGP algorithm.
10. An electronic memory device comprising:
a plurality of layers of memory circuitry, wherein each layer of memory circuitry comprises a plurality of storage locations; and
data encryption logic interconnected to at least one of the layers of memory circuitry,
wherein the layer of data encryption logic is disposed on a substrate disposed beneath the plurality of layers of memory circuitry.
11. The electronic memory device of claim 10 , wherein the substrate comprises a semiconductor material.
12. The electronic memory device of claim 10 , further comprising a microprocessor disposed on the substrate, the microprocessor comprising the data encryption logic.
13. The electronic memory device of claim 10 , wherein the data encryption logic utilizes a DES algorithm.
14. The electronic memory device of claim 10 , wherein the data encryption logic utilizes a PGP algorithm.
15. An electronic memory device comprising:
a plurality of layers of memory circuitry, wherein each layer of memory circuitry comprises a plurality of storage locations; and
data compression logic interconnected to at least one of the layers of memory circuitry,
wherein the data compression logic is disposed on a substrate disposed beneath the plurality of layers of memory circuitry.
16. The electronic memory device of claim 15 , wherein the substrate comprises a semiconductor material.
17. The electronic memory device of claim 15 , further comprising a microprocessor disposed on the substrate, the microprocessor comprising the data compression logic.
18. The electronic memory device of claim 15 , wherein the data compression logic utilizes an MP3 algorithm.
19. An electronic memory device comprising:
a plurality of layers of memory circuitry, wherein each layer of memory circuitry comprises a plurality of storage locations; and
data decompression logic interconnected to at least one of the layers of memory circuitry,
wherein the data decompression logic is disposed on a substrate disposed beneath the plurality of layers of memory circuitry.
20. The electronic memory device of claim 19 , wherein the substrate comprises a semiconductor material.
21. The electronic memory device of claim 19 , further comprising a microprocessor disposed on the substrate, the microprocessor comprising the data decompression logic.
22. The electronic memory device of claim 19 , wherein the data decompression logic utilizes an MP3 algorithm.