Wafer-leveled chip packaging structure and method thereof
View Patent ↗This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.
1. A wafer-leveled chip packaging method, comprising following steps:
(A) providing a wafer having an integrated circuit, wherein said wafer has a first surface on which a plurality of pads is mounted;
(B) forming a first insulating layer on said first surface of said wafer;
(C) forming a plurality of first conductive vias penetrating said first insulating layer, wherein parts of said first conductive vias are connected with said pads;
(D) forming a first conductive pattern layer on the surface of said first insulating layer which is opposite to said wafer, wherein said first conductive pattern layer is electrically connected with said first conductive vias;
(E) forming a plurality of through holes penetrating said wafer so that parts of said first conductive vias contacting with said wafer are exposed;
(F) filling a second insulating layer in said through holes; and
(G) forming a plurality of second conductive vias in said second insulating layer within said through holes, and said second conductive vias are electrically connected with said first conductive vias.
2. The wafer-leveled chip packaging method of claim 1 , further comprising step (A 1 ) attaching at least one first chip having at least one pad to said first surface of said wafer, wherein said pad is disposed on the surface of said first chip which is opposed to said wafer after step (A).
3. The wafer-leveled chip packaging method of claim 1 , wherein said first conductive vias and said second conductive vias are formed by laser or photolithography to generate via-holes in which a conductive material is then filled by electroplating, electroless plating or the combination thereof.
4. The wafer-leveled chip packaging method of claim 1 , further comprising step (D 1 ) forming a third insulating layer having a pattern on said first conductive pattern layer to protect said first conductive pattern layer after step (D).
5. The wafer-leveled chip packaging method of claim 4 , further comprising step (D 2 ) forming a plurality of solder balls or needle pins in said third insulating layer, wherein said solder balls or needle pins are electrically connected with said first conductive pattern layer after step (D 1 ).
6. The wafer-leveled chip packaging method of claim 4 , further comprising step (D 3 ) attaching at least one second chip having at least one pad to said third insulating layer, wherein said pad is disposed on the surface of said second chip which is opposed to the said third insulating layer after step (D 1 ).
7. The wafer-leveled chip packaging method of claim 1 , wherein said second conductive vias are formed by laser drilling to form via-holes, and then by metalizing the inner surfaces of said via-holes.
8. The wafer-leveled chip packaging method of claim 1 , further comprising step (G 1 ) soldering a plurality of solder balls or needle pins to said second conductive vias after step (G).
9. The wafer-leveled chip packaging method of claim 1 , further comprising step (H) dicing said wafer to form a plurality of chip scale package structures after step (G).
10. A wafer-leveled chip packaging method, comprising following steps:
(A) providing a wafer having a first surface;
(B) attaching at least one first chip having a plurality of pads to said first surface of said wafer;
(C) forming a first insulating layer on said first surface of said wafer;
(D) forming a plurality of first conductive vias penetrating said first insulating layer, wherein parts of said first conductive vias are electrically connected with said pads of said first chip;
(E) forming a first conductive pattern layer on the surface of said first insulating layer which is opposite to said wafer, wherein said first conductive pattern layer is electrically connected with said first conductive vias;
(F) forming a plurality of through holes penetrating said wafer so that parts of said first conductive vias contacting with said wafer are exposed;
(G) filling a second insulating layer in said through holes; and
(H) forming a plurality of second conductive vias in said second insulating layer within said through holes, and said second conductive vias are electrically connected with said first conductive vias.
11. The wafer-leveled chip packaging method of claim 10 , wherein said first chip is attached to said first surface of said wafer with a thermal adhesive or a non-conductive adhesive and said pads are disposed on the surface of said first chip which is opposed to said wafer.
12. The wafer-leveled chip packaging method of claim 10 , wherein said first conductive vias and said second conductive vias are formed by laser or photolithography to generate via-holes in which a conductive material is then filled by electroplating, electroless plating or the combination thereof.
13. The wafer-leveled chip packaging method of claim 10 , further comprising step (E 1 ) forming a third insulating layer having a pattern on said first conductive pattern layer to protect said first conductive pattern layer after step (E).
14. The wafer-leveled chip packaging method of claim 13 , further comprising step (E 2 ) forming a plurality of solder balls or needle pins in said third insulating layer, wherein said solder balls or needle pins are electrically connected with said first conductive pattern layer after step (E 1 ).
15. The wafer-leveled chip packaging method of claim 10 , further comprising step (I) dicing said wafer to form a plurality of chip scale package structures after step (H).
16. The wafer-leveled chip packaging method of claim 13 , further comprising step (E 3 ) attaching at least one second chip having at least one pad to said third insulating layer after step (E 1 ).
17. The wafer-leveled chip packaging method of claim 10 , wherein said second conductive vias are formed by laser drilling to form via-holes, and then by metalizing the inner surfaces of said via-holes.
18. The wafer-leveled chip packaging method of claim 10 , further comprising step (H 1 ) soldering a plurality of solder balls or needle pins to said second conductive vias after step (H).