IP Library › Assignment 028708/0649
Patent Assignment
Reel/Frame 028708/0649

Assignment of Assignor's Interest

Recorded: 2012-08-01 Pages: 4
Assignor
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (4)
Wafer-Leveled Chip Packaging Structure and Method Thereof
Patent: 7,294,920 →
Application: 11/186,840 →
Publication: US 2006/0019484
Wafer-Leveled Chip Packaging Structure and Method Thereof
Patent: 7,528,009 →
Application: 11/785,612 →
Publication: US 2007/0197018
Semiconductor Package Device
Patent: 8,314,482 →
Application: 11/905,869 →
Publication: US 2008/0029870
Wafer-Leveled Chip Packaging Structure and Method Thereof
Patent: 8,587,091 →
Application: 13/533,251 →
Publication: US 2012/0267765
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2005
From: CHEN, SHOU-LUNG; HSIAO, CHIN-WEN; CHEN, YU-HUA; KO, JENG-DAR
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 016808/0467 →
Corrective Coversheet to Correct Inventor Ching-Wen Hsiao Given Name from Chin to Chlng Previously Recorded on Reel 016808, Frame 0467. Oct 5, 2007
From: CHEN, SHOU-LUNG; HSIAO, CHING-WEN; CHEN, YU-HUA; KO, JENG-DAR
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 019981/0244 →
Corrective Assignment to Correct Address of Receiving Party Previously Recorded on Reel 028708, Frame 0649. Aug 22, 2012
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: INVENSAS CORPORATION
Reel/Frame 028832/0560 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →