Patent Assignment
Reel/Frame 016808/0467
Assignment of Assignor's Interest
Recorded: 2005-07-22
Pages: 5
Assignors
CHEN, SHOU-LUNG
Executed: 2005-07-19
HSIAO, CHIN-WEN
Executed: 2005-07-19
CHEN, YU-HUA
Executed: 2005-07-19
KO, JENG-DAR
Executed: 2005-07-19
TZENG, CHIH-MING
Executed: 2005-07-21
LIN, JYH-RONG
Executed: 2005-07-19
YU, SHAN-PU
Executed: 2005-07-19
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Wafer-Leveled Chip Packaging Structure and Method Thereof
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Coversheet to Correct Inventor Ching-Wen Hsiao Given Name from Chin to Chlng Previously Recorded on Reel 016808, Frame 0467.
Oct 5, 2007
From: CHEN, SHOU-LUNG; HSIAO, CHING-WEN; CHEN, YU-HUA; KO, JENG-DAR
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 019981/0244 →
Assignment of Assignor's Interest
Aug 1, 2012
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: INVENSAS CORPORATION
Reel/Frame 028708/0649 →
Corrective Assignment to Correct Address of Receiving Party Previously Recorded on Reel 028708, Frame 0649.
Aug 22, 2012
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: INVENSAS CORPORATION
Reel/Frame 028832/0560 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →