IP Library Granted Patent US 7,606,098
Granted Patent B2
US 7,606,098 · App. 11/787,718 · Granted Oct 20, 2009

Semiconductor memory array architecture with grouped memory cells, and method of controlling same

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Quick Facts
Patent No.
US 7,606,098
App. No.
11/787,718
Granted
Oct 20, 2009
Kind
B2
Abstract

An integrated circuit device (e.g., a logic device or a memory device) having a memory cell array including a plurality of word lines (e.g., first and second word lines) and a plurality of word line segments (e.g., first and second word line segments) wherein each word line segment is coupled to an associated word line (e.g., a first segment is associated with the first word line and a second segment is associated with the second word line). The memory cell array further includes a plurality of memory cells, wherein each memory cell includes a transistor having a first region, a second region, a body region, wherein the body region is electrically floating, and a gate coupled to an associated word line via an associated word line segment. A first group of memory cells is coupled to the first word line via the first word line segment and a second group of memory cells is coupled to the second word line via the second word line segment wherein at least one memory cell of the first group of memory cells is adjacent to at least one memory cell of the second group of memory cells.

Claims (128)

1. An integrated circuit device comprising:

a memory cell array including:

a plurality of word lines including a first word line and a second word line;

a plurality of word line segments including a first word line segment and a second word line segment, wherein each word line segment is coupled to an associated word line and wherein the first word line segment is associated with the first word line and the second word line segment is associated with the second word line;

a plurality of bit lines; and

a plurality of memory cells, wherein each memory cell stores at least one data state and includes a transistor, wherein the transistor includes:

a first region coupled to an associated bit line;

a second region;

a body region disposed between the first region and the second region, wherein the body region is electrically floating; and

a gate coupled to an associated word line via an associated word line segment; and

wherein:

a first group of memory cells is coupled to the first word line via the first word line segment and a second group of memory cells is coupled to the second word line via the second word line segment; and

at least one memory cell of the first group of memory cells is adjacent to at least one memory cell of the second group of memory cells;

first circuitry, coupled to (i) a first memory cell in the first group of memory cells and (ii) a first memory cell in the second group of memory cells, to sense a data state stored in the first memory cell and a data state stored in the second memory cell wherein the first memory cell in the second group of memory cells is adjacent to one of the memory cells in the first group of memory cells; and

reference generator circuitry, coupled to the first circuitry, to provide a reference to the first circuitry wherein the first circuitry uses the reference to sense the data state stored in each memory cell coupled to the first and second bit lines.

2. The integrated circuit device of claim 1 wherein the number of memory cells in the first group of memory cells is two.

3. The integrated circuit device of claim 1 wherein the number of memory cells in the first group of memory cells is two or more.

4. The integrated circuit device of claim 1 wherein the number of memory cells in the first group of memory cells is substantially equal to a pitch of the first circuitry.

5. The integrated circuit device of claim 1 further including second circuitry, coupled to (i) a second memory cell in the first group of memory cells and (ii) a second memory cell in the second group of memory cells, wherein the first circuitry is located on a first side of the first and second groups of memory cells and the second circuitry is located on a second side of the first and second groups of memory cells, wherein the first side is opposite the second side.

6. The integrated circuit device of claim 1 further including bit line selection circuitry disposed between (i) the first circuitry and (ii) the first and second bit lines, to connect the first bit line to the first circuitry in response to a first signal and the second bit line to the first circuitry in response to a second signal.

7. An integrated circuit device comprising:

a memory cell array including:

a plurality of word lines including a first word line and a second word line;

a plurality of word line segments including a first word line segment and a second word line segment, wherein each word line segment is coupled to an associated word line and wherein the first word line segment is associated with the first word line and the second word line segment is associated with the second word line;

a plurality of bit lines; and

a plurality of memory cells, wherein each memory cell stores at least one data state and includes a transistor, wherein the transistor includes:

a first region coupled to an associated bit line;

a second region;

a body region disposed between the first region and the second region, wherein the body region is electrically floating; and

a gate coupled to an associated word line via an associated word line segment; and

wherein:

a first group of memory cells is coupled to the first word line via the first word line segment and a second group of memory cells is coupled to the second word line via the second word line segment; and

at least one memory cell of the first group of memory cells is adjacent to at least one memory cell of the second group of memory cells;

first circuitry, coupled to a first bit line and a second bit line, to sense a data state stored in each memory cell coupled to the first and second bit lines, wherein:

the first region of the transistor of the first memory cell in the first group of memory cells is coupled to the first circuitry via the first bit line; and

the first region of the transistor of the first memory cell in the second group of memory cells is coupled to the first circuitry via the second bit line; and

bit line selection circuitry to responsively connect the first bit line or second bit line to the first circuitry.

8. The integrated circuit device of claim 7 further including reference generator circuitry, coupled to the first circuitry, to provide a reference to the first circuitry wherein the first circuitry uses the reference to sense the data state stored in each memory cell coupled to the first and second bit lines.

9. The integrated circuit device of claim 7 wherein the number of memory cells in the first group of memory cells is two or more.

10. The integrated circuit device of claim 7 wherein the number of memory cells in the first group of memory cells is substantially equal to a pitch of the first circuitry.

11. The integrated circuit device of claim 7 further including second circuitry, coupled to (i) a second memory cell in the first group of memory cells and (ii) a second memory cell in the second group of memory cells, wherein the first circuitry is located on a first side of the first and second groups of memory cells and the second circuitry is located on a second side of the first and second groups of memory cells, wherein the first side is opposite the second side.

12. An integrated circuit device comprising:

a memory cell array including:

a plurality of word lines including a first word line and a second word line;

a plurality of word line segments including a first word line segment and a second word line segment, wherein each word line segment is coupled to an associated word line and wherein the first word line segment is associated with the first word line and the second word line segment is associated with the second word line;

a plurality of bit lines; and

a plurality of memory cells, wherein each memory cell stores at least one data state and includes a transistor, wherein the transistor includes:

a first region coupled to an associated bit line;

a second region;

a body region disposed between the first region and the second region, wherein the body region is electrically floating; and

a gate coupled to an associated word line via an associated word line segment; and

wherein:

a first group of memory cells is coupled to the first word line via the first word line segment and a second group of memory cells is coupled to the second word line via the second word line segment; and

at least one memory cell of the first group of memory cells is adjacent to at least one memory cell of the second group of memory cells; and

first circuitry, coupled to a first memory cell in the first group of memory cells, to sense the data state stored in a first memory cell;

wherein the number of memory cells in the first group of memory cells is substantially equal to a pitch of the first or second circuitry.

13. The integrated circuit device of claim 12 further including reference generator circuitry, coupled to the first circuitry, to provide a reference to the first circuitry wherein the first circuitry uses the reference to sense the data state stored in each memory cell coupled to the first and second bit lines.

14. The integrated circuit device of claim 12 wherein the number of memory cells in the first group of memory cells is two or more.

15. An integrated circuit device comprising:

a memory cell array including:

a plurality of word lines including a first word line and a second word line;

a plurality of word line segments including a first word line segment and a second word line segment, wherein each word line segment is coupled to an associated word line and wherein the first word line segment is associated with the first word line and the second word line segment is associated with the second word line;

a plurality of bit lines; and

a plurality of memory cells, each memory cell includes a transistor, wherein the transistor includes:

a first region coupled to an associated bit line;

a second region;

a body region disposed between the first region and the second region, wherein the body region is electrically floating; and

a gate coupled to an associated word line via an associated word line segment; and

wherein each memory cell stores at least one data state including:

(i) a first data state which is representative of a first charge in the body region of the associated electrically floating body transistor; and

(ii) a second data state which is representative of a second charge in the body region of the associated electrically floating body transistor; and

wherein:

a first group of memory cells is coupled to the first word line via the first word line segment and a second group of memory cells is coupled to the second word line via the second word line segment; and

at least one memory cell of the first group of memory cells is adjacent to at least one memory cell of the second group of memory cells.

16. The integrated circuit device of claim 15 wherein the number of memory cells in the first group of memory cells is two or more.

17. The integrated circuit device of claim 15 further including:

first circuitry, coupled to a first memory cell in the first group of memory cells, to sense the data state stored in a first memory cell;

second circuitry, coupled to a second memory cell in the first group of memory cells, to sense the data state stored in a second memory cell;

wherein the number of memory cells in the first group of memory cells is substantially equal to a pitch of the first or second circuitry.

18. The integrated circuit device of claim 15 further including:

first circuitry, coupled to a first memory cell in the first group of memory cells, to sense the data state stored in a first memory cell;

second circuitry, coupled to a second memory cell in the first group of memory cells, to sense the data state stored in a second memory cell;

wherein:

the first circuitry is coupled to a first memory cell in the second group of memory cells, to sense the data state stored in a first memory cell in the second group of memory cells;

the second circuitry is coupled to a second memory cell in the second group of memory cells, to sense the data state stored in a second memory cell in the second group of memory cells; and

the first circuitry is located on a first side of the first and second groups of memory cells and the second circuitry is located on a second side of the first and second groups of memory cells, wherein the first side is opposite the second side.

19. The integrated circuit device of claim 15 further including first circuitry, coupled to (i) a first memory cell in the first group of memory cells and (ii) a first memory cell in the second group of memory cells, to sense the data state stored in the first memory cell and the second memory cell wherein the first memory cell in the second group of memory cells is adjacent to one of the memory cells in the first group of memory cells.

20. The integrated circuit device of claim 15 further including:

first circuitry, coupled to a first bit line and a second bit line, to sense the data state stored in each memory cell connected to the first and second bit lines, wherein:

the first region of the transistor of the first memory cell in the first group of memory cells is coupled to the first circuitry via the first bit line; and

the first region of the transistor of the first memory cell in the second group of memory cob is coupled to the first circuitry via the second bit line; and

bit line selection circuitry to responsively connect the first bit line or second bit line to the first circuitry.

21. The integrated circuit device of claim 15 further including:

first circuitry, coupled to a first bit line and a second bit line, to sense the data state stored in each memory cell connected to the first and second bit lines, wherein:

the first region of the transistor of the first memory cell in the first group of memory cells is coupled to the first circuitry via the first bit line; and

the first region of the transistor of the first memory cell in the second group of memory cells is coupled to the first circuitry via the second bit line; and

bit line selection circuitry disposed between (i) the first circuitry and (ii) the first and second bit lines, to connect the first bit line to the first circuitry in response to a first signal and the second bit line to the first circuitry in response to a second signal.

22. An integrated circuit device comprising:

a memory cell any including:

a plurality of word lines including a first word line and a second word line;

a plurality of word line segments including a first word line segment and a second word line segment, wherein each word line segment is coupled to an associated word line and wherein the first word line segment is associated with the first word line and the second word line segment is associated with the second word line;

a plurality of bit lines; and

a plurality of memory cells, each memory cell storing at least one memory state and consisting essentially of a transistor, wherein the transistor includes:

a first region coupled to an associated bit line;

a second region;

a body region disposed between the first region and the second region, wherein the body region is electrically floating; and

a gate coupled to an associated word line via an associated word line segment; and

wherein:

a first group of memory cells is coupled to the first word line via the first word line segment and a second group of memory cells is coupled to the second word line via the second word line segment; and

at least one memory cell of the first group of memory cells is adjacent to at least one memory cell of the second group of memory cells.

23. The integrated circuit device of claim 22 further including:

first circuitry, coupled to a first memory cell in the first group of memory cells, to sense the data state stored in a first memory cell;

wherein the number of memory cells in the first group of memory cells is substantially equal to a pitch of the first circuitry.

24. The integrated circuit device of claim 22 further including:

first circuitry, coupled to a first memory cell in the first group of memory cells, to sense the data state stored in a first memory cell;

second circuitry, coupled to a second memory cell in the first group of memory cells, to sense the data state stored in a second memory cell; and

wherein:

the first circuitry is coupled to a first memory cell in the second group of memory cells, to sense the data state stored in a first memory cell in the second group of memory cells;

the second circuitry is coupled to a second memory cell in the second group of memory cells, to sense the data state stored in a second memory cell in the second group of memory cells; and

the first circuitry is located on a first side of the first and second groups of memory cells and the second circuitry is located on a second side of the first and second groups of memory cells, wherein the first side is opposite the second side.

25. The integrated circuit device of claim 22 further including first circuitry, coupled to (i) a first memory cell in the first group of memory cells and (ii) a first memory cell in the second group of memory cells, to sense the data state stored in the first memory cell and the second memory cell wherein the first memory cell in the second group of memory cells is adjacent to one of the memory cells in the first group of memory cells.

26. The integrated circuit device of claim 25 further including reference generator circuitry, coupled to the first circuitry, to provide a reference to the first circuitry wherein the first circuitry uses the reference to sense the data state stored in each memory cell coupled to the first and second bit lines.

27. The integrated circuit device of claim 22 further including:

first circuitry, coupled to a first bit line and a second bit line, to sense the data state stored in each memory cell connected to the first and second bit lines, wherein:

the first region of the transistor of the first memory cell in the first group of memory cells is coupled to the first circuitry via the first bit line; and

the first region of the transistor of the first memory cell in the second group of memory cells is coupled to the first circuitry via the second bit line; and

bit line selection circuitry disposed between (i) the first circuitry and (ii) the first and second bit lines, to connect the first bit line to the first circuitry in response to a first signal and the second bit line to the first circuitry in response to a second signal.

28. The integrated circuit device of claim 27 further including reference generator circuitry, coupled to the first circuitry, to provide a reference to the first circuitry wherein the first circuitry uses the reference to sense the data state stored in each memory cell coupled to the first and second bit lines.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2011
From: INNOVATIVE SILICON ISI S.A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025850/0798 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 019674 FRAME 0319. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 2, 2008
From: POPOFF, GREGORY ALLAN
To: INNOVATIVE SILICON ISI SA
Reel/Frame 021910/0251 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2007
From: POPOFF, GREGORY ALLAN
To: INNOVATIVE SILICON S.A.
Reel/Frame 019674/0319 →