Semiconductor memory cell and array using punch-through to program and read same
View Patent ↗An integrated circuit device (for example, logic or discrete memory device) comprising a memory cell including a punch-through mode transistor, wherein the transistor includes a source region, a drain region, a gate, a gate insulator, and a body region having a storage node which is located, at least in part, immediately beneath the gate insulator. The memory cell includes at least two data states which are representative of an amount of charge in the storage node in the body region. First circuitry is coupled to the punch-through mode transistor of the memory cell to: (1) generate first and second sets of write control signals, and (2 a ) apply the first set of write control signals to the transistor to write a first data state in the memory cell and (2 b ) apply the second set of write control signals to the transistor to write a second data state in the memory cell. In response to the first set of write control signals, the punch-through mode transistor provides at least the first charge in the body region via impact ionization. The transistor may be disposed on a bulk-type substrate or SOI-type substrate.
1. An integrated circuit device comprising:
a memory cell including at least one transistor, wherein the transistor, in operation, operates in a punch-through, the transistor includes:
a first region having impurities to provide a first conductivity type and a first junction;
a second region having impurities to provide a first conductivity type and a second junction, wherein in operation, the first and second junctions of the transistor abut or overlap;
a body region, disposed between the first region and the second region, having impurities to provide a second conductivity type wherein the second conductivity type is different from the first conductivity type; and
a gate disposed over the body region; and
a gate insulator disposed between the gate and the body region wherein the body region includes a storage node which is: (i) located, at least in part, immediately beneath the gate insulator and (ii) separated from portions of the body region by the abutting or overlapping first and second junctions of the transistor; and
wherein the memory cell includes at least two data states including (i) a first data state which is representative of a first charge in the body region, and (ii) a second data state which is representative of a second charge in the body region;
first circuitry, coupled to the transistor of the memory cell, to: (1) generate first and second sets of write control signals and (2a) apply the first set of write control signals to the transistor to write the first data state in the memory cell and (2b) apply the second set of write control signals to the transistor to write the second data state in the memory cell; and
wherein, in response to the first set of write control signals, the transistor provides at least the first charge in the body region via impact ionization.
2. The integrated circuit device of claim 1 wherein the body region of the transistor is electrically floating.
3. The integrated circuit device of claim 1 wherein the first charge is substantially stored in the storage node of the body region.
4. The integrated circuit device of claim 1 wherein the transistor is disposed in or on a semiconductor region or layer which resides on or above an insulating region or layer of a substrate wherein the body region is disposed between the first region, the second region, the gate insulator and the insulating region or layer of the substrate.
5. The integrated circuit device of claim 1 wherein transistor is disposed on bulk-type semiconductor substrate.
6. The integrated circuit device of claim 1 wherein the transistor is disposed on SOI-type substrate.
7. The integrated circuit device of claim 1 wherein, in response to read control signals applied to the memory cell, the transistor generates a punch-through current which is representative of the data state of the memory cell and wherein the data sense circuitry determines the data state of the memory cell at least substantially based on the second bipolar transistor current.
8. The integrated circuit device of claim 1 further including second circuitry to read the data state of the memory cell wherein second circuitry determines the data state of the memory cell at least substantially based on a punch-through current.
9. An integrated circuit device comprising:
a memory cell including at least one punch-through mode transistor, wherein the punch-through mode transistor includes:
a first region;
a second region;
a body region disposed between the first region and the second region; and
a gate disposed over the body region; and
a gate insulator disposed between the gate and the body region wherein the body region includes a storage node which is: (i) located, at least in part, immediately beneath the gate insulator and (ii) separated from portions of the body region by abutting or overlapping junctions of the punch-through mode transistor; and
wherein the memory cell includes at least two data states including (i) a first data state which is representative of a first charge in the body region, and (ii) a second data state which is representative of a second charge in the body region;
first circuitry, coupled to the transistor of the memory cell, to: (1) generate first and second sets of write control signals and (2a) apply the first set of write control signals to the transistor to write the first data state in the memory cell and (2b) apply the second set of write control signals to the transistor to write the second data state in the memory cell; and
wherein, in response to the first set of write control signals, the transistor stores at least the first charge in the body region wherein the first charge is provided or created via impact ionization and, in response to the second set of write control signals, the transistor stores no more than the second charge in the body region.
10. The integrated circuit device of claim 9 wherein the first charge is substantially stored in the storage node of the body region.
11. The integrated circuit device of claim 9 wherein the body region of the transistor is electrically floating.
12. The integrated circuit device of claim 9 wherein the transistor is disposed in or on a semiconductor region or layer which resides on or above an insulating region or layer of a substrate wherein the body region is disposed between the first region, the second region, the gate insulator and the insulating region or layer of the substrate.
13. The integrated circuit device of claim 9 wherein transistor is disposed on bulk-type semiconductor substrate.
14. The integrated circuit device of claim 9 wherein the transistor is disposed on SOI-type substrate.
15. The integrated circuit device of claim 9 wherein, in response to read control signals applied to the memory cell, the transistor generates a punch-through current which is representative of the data state of the memory cell and wherein the data sense circuitry determines the data state of the memory cell at least substantially based on the punch-through current.
16. The integrated circuit device of claim 9 further including second circuitry to read the data state of the memory cell wherein second circuitry determines the data state of the memory cell at least substantially based on a punch-through current.
17. The integrated circuit device of claim 9 wherein the second charge is provided in the body region by causing majority carriers out of the body region via the first and/or second regions.
18. An integrated circuit device comprising:
a memory cell including at least one punch-through mode transistor, wherein the punch-through mode transistor includes:
a first region;
a second region;
a body region disposed between the first region and the second region; and
a gate disposed over the body region;
a gate insulator disposed between the gate and the body region wherein the body region includes a storage node which is: (i) located, at least in part, immediately beneath the gate insulator and (ii) separated from portions of the body region by abutting or overlapping junctions of the punch-through mode transistor, and
wherein the memory cell includes at least two data states which are representative of an amount of charge in the body region;
first circuitry, coupled to the punch-through mode transistor of the memory cell, to: (1) generate first and second sets of write control signals and (2a) apply the first set of write control signals to the punch-through mode transistor to write a first data state in the memory cell and (2b) apply the second set of write control signals to the punch-through mode transistor to write a second data state in the memory cell; and
wherein, in response to the first set of write control signals, the punch-through mode transistor stores a charge in the body region which is provided or created via impact ionization.
19. The integrated circuit device of claim 18 wherein the charge is substantially stored in the storage node of the body region.
20. The integrated circuit device of claim 18 wherein the body region of the punch-through mode transistor is electrically floating.
21. The integrated circuit device of claim 18 wherein the punch-through mode transistor is disposed in or on a semiconductor region or layer which resides on or above an insulating region or layer of a substrate wherein the body region is disposed between the first region, the second region, the gate insulator and the insulating region or layer of the substrate.
22. The integrated circuit device of claim 18 wherein punch-through mode transistor is disposed on bulk-type semiconductor substrate.
23. The integrated circuit device of claim 18 wherein the punch-through mode transistor is disposed on SOI-type substrate.
24. The integrated circuit device of claim 18 wherein, in response to read control signals applied to the memory cell, the punch-through mode transistor generates a punch-through current which is representative of the data state of the memory cell and wherein the data sense circuitry determines the data state of the memory cell at least substantially based on the punch-through current.
25. The integrated circuit device of claim 18 further including second circuitry to read the data state of the memory cell wherein second circuitry determines the data state of the memory cell at least substantially based on a punch-through current.
26. An integrated circuit device comprising:
a memory cell including at least one transistor, wherein the transistor, in operation, operates in a punch-through, the transistor includes:
a first region having impurities to provide a first conductivity type and a first junction;
a second region having impurities to provide a first conductivity type and a second junction, wherein in operation, the first and second junctions of the transistor abut or overlap;
a body region, disposed between the first region and the second region, having impurities to provide a second conductivity type wherein the second conductivity type is different from the first conductivity type; and
a gate disposed over the body region;
a gate insulator disposed between the gate and the body region wherein the body region includes a storage node which is: (i) located, at least in part, immediately beneath the gate insulator and (ii) separated from portions of the body region by the abutting or overlapping first and second junctions of the transistor, and
wherein the memory cell includes at least two data states which are representative of an amount of charge in the body region;
first circuitry, coupled to the transistor of the memory cell, to: (1) generate first and second sets of write control signals and (2a) apply the first set of write control signals to the transistor to write a first data state in the memory cell and (2b) apply the second set of write control signals to the transistor to write a second data state in the memory cell; and
wherein, in response to the first set of write control signals, the transistor stores a charge in the body region which is provided or created via impact ionization.
27. he integrated circuit device of claim 26 wherein the charge is substantially stored in the storage node of the body region.
28. The integrated circuit device of claim 26 wherein the body region of the transistor is electrically floating.
29. The integrated circuit device of claim 26 wherein the transistor is disposed in or on a semiconductor region or layer which resides on or above an insulating region or layer of a substrate wherein the body region is disposed between the first region, the second region, the gate insulator and the insulating region or layer of the substrate.
30. The integrated circuit device of claim 26 wherein transistor is disposed on bulk-type semiconductor substrate.
31. The integrated circuit device of claim 26 wherein the transistor is disposed on SOI-type substrate.
32. The integrated circuit device of claim 26 wherein, in response to read control signals applied to the memory cell, the transistor generates a punch-through current which is representative of the data state of the memory cell and wherein the data sense circuitry determines the data state of the memory cell at least substantially based on the punch-through current.
33. The integrated circuit device of claim 26 further including second circuitry to read the data state of the memory cell wherein second circuitry determines the data state of the memory cell at least substantially based on a punch-through current.