IP Library Granted Patent US 7,453,275
Granted Patent B2
US 7,453,275 · App. 11/798,809 · Granted Nov 18, 2008

Probe card

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,453,275
App. No.
11/798,809
Granted
Nov 18, 2008
Kind
B2
Abstract

The board of a probe card of the present invention comprises a first substrate having a first inclined surface at the side surfaces and a second substrate having a second inclined surface. The first substrate and the second substrate are disposed such that the first inclined surface and the second inclined surface are opposed to each other. Between the first inclined surface and the second inclined surface, a stress absorber having electroconductivity is sandwiched.

Claims (52)

1. A probe card comprising:

a board having through-holes formed therein, into which probes are to be inserted, and probes extending from said through-holes are abutted on a measurement object so as to measure a variety of electrical properties of said measurement object; and

an electroconductive elastic member,

wherein said board extends along a plane,

wherein said board comprises a first substrate having a first inclined end surface at an end thereof, and a second substrate having a second inclined end surface at an end thereof, said first inclined end surface and said second inclined end surface being inclined with respect to the plane, and

wherein said first substrate and said second substrate are disposed adjacent one another such that said first inclined end surface and said second inclined end surface are opposed to each other, and said electroconductive elastic member is located between said first inclined end surface and said second inclined end surface.

2. The probe card according to claim 1 , further comprising a fixing member for fixing together said first substrate and said second substrate, said fixing member being adapted to abut a first end surface and a second end surface of said second substrate, each of said second substrate first end surface and said second substrate second end surface extending parallel to the plane and adjoining the second inclined end surface, and to abut a first end surface of said first substrate to which said probe extends, said first substrate first end surface extending parallel to the plane and adjoining the first inclined end surface,

wherein a gap is formed between said fixing member and a second end surface of said first substrate, said first substrate second end surface extending parallel, to the plane and adjoining the first inclined end surface.

3. The probe card according to claim 1 ,

wherein said through-holes are located in the first substrate and have a diameter narrowing toward the first substrate second end surface, and

wherein said through-holes have a tapered shape corresponding to a tapered shape of end portions of the probes, the tapered shape of the through-holes and the tapered shape of the end portions of the probes defining a common angle with respect to the plane.

4. The probe card according to claim 2 ,

wherein said through-holes are located in the first substrate and have a diameter narrowing toward the first substrate second end surface, and

wherein said through-holes have a tapered shape corresponding to a tapered shape of end portions of the probes, the tapered shape of the through-holes and the tapered shape of the end portions of the probes defining a common angle with respect to the plane.

5. The probe card according to claim 1 , wherein said electroconductive elastic member is adapted to at least partially absorb a force applied to said first substrate.

6. The probe card according to claim 5 , wherein the force applied to said first substrate is a mechanical force.

7. The probe card according to claim 1 ,

wherein said first substrate has an end surface extending parallel to the plane and adjoining the first inclined end surface,

wherein said second substrate has an end surface extending parallel to the plane and adjoining the second inclined end surface, and

wherein said first substrate and said second substrate are disposed such that said first substrate end surface is substantially level with said second substrate end surface.

8. A probe card comprising:

a first substrate having a ramped end surface at an end thereof the first substrate having through-holes for receiving a plurality of probes;

a second substrate having a ramped end surface at an end thereof; and

an electroconductive elastic member,

wherein said first substrate and said second substrate are disposed adjacent one another such that said first substrate ramped end surface and said second substrate ramped end surface face one another, and such that the electroconductive elastic member is located between said first substrate ramped end surface and said second substrate ramped end surface.

9. The probe card according. to claim 8 , wherein said electroconductive elastic member is adapted to at least partially absorb a force applied to said first substrate.

10. The probe card according to claim 9 . wherein the force applied to said first substrate is a mechanical force.

11. The probe card according to claim 8 ,

wherein said probe card extends along a plane,

wherein said first substrate has an end surface extending parallel to the plane and adjoining said first substrate ramped end surface,

wherein said second substrate has an end surface extending parallel to the plane and adjoining said second substrate ramped end surface, and

wherein said first substrate and said second substrate are disposed such that said first substrate end surface is substantially level with said second substrate end surface.

12. A probe card comprising:

a first substrate having a ramped end surface at an end thereof, said first substrate having through-holes for receiving a plurality of probes;

a second substrate having a ramped end surface at an end thereof; and

an elastic member located between said first substrate ramped end surface and said second substrate ramped end surface,

wherein said probe card extends along a plane, and

wherein said ramped end surface of said first substrate and said ramped end surface of said second substrate incline at said plane.

13. The probe card according to claim 12 ,

wherein said first substrate has a first main surface extending parallel to said plane and a second main surface extending parallel to said plane,

wherein said plurality of probes extend from said first main surface, and

wherein said first main surface is larger than said second main surface.

14. The probe card according to claim 13 , further comprising:

a fixing member fixing together said first substrate and said second substrate.

15. The probe card according to claim 14 ,

wherein said second substrate has a first main surface extending parallel to said plane and a second main surface extending parallel to said plane, and

wherein said fixing member has a first portion adapted to abut said first main surface of said first substrate and said main surface of said second substrate, and a second portion adapted to abut said second main surface of said second substrate.

16. The probe card according to claim 15 ,

wherein said second portion of said fixing member has a gap to said second main surface of said first substrate.

17. The probe card according to claim 15 ,

wherein said second portion of said fixing member is extended onto said second main surface of said first substrate.

18. The probe card according to claim 12 , wherein said elastic member is an electroconductive elastic member.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2014
From: ELPIDA MEMORY, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 032645/0422 →