IP Library Granted Patent US 7,323,367
Granted Patent B1
US 7,323,367 · App. 11/799,496 · Granted Jan 29, 2008

Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions

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Quick Facts
Patent No.
US 7,323,367
App. No.
11/799,496
Granted
Jan 29, 2008
Kind
B1
Abstract

Diagonal deep well region for routing the body-bias voltage for MOSFETS in surface well regions is provided and described.

Claims (32)

1. A method of routing a body-bias voltage to surface wells of a first conductivity in a semiconductor device, said method comprising:

forming a sub-surface layer of said first conductivity below a surface of said semiconductor device and below said surface wells;

forming gap regions in said sub-surface layer, wherein said gap regions are oriented diagonally with respect to an orientation of said surface wells;

electrically coupling said sub-surface layer to said surface wells to create a conductive path; and

applying said body-bias voltage to said sub-surface layer.

2. The method as recited in claim 1 wherein said sub-surface layer has an N-type doping.

3. The method as recited in claim 2 wherein said surface wells have an N-type doping.

4. The method as recited in claim 3 wherein each surface well includes a p-type MOSFET (metal oxide semiconductor field effect transistor).

5. The method as recited in claim 1 wherein said sub-surface layer has a P-type doping.

6. The method as recited in claim 5 wherein said surface wells have a P-type doping.

7. The method as recited in claim 6 wherein each surface well includes an n-type MOSFET (metal oxide semiconductor field effect transistor).

8. A method of routing a body-bias voltage to surface wells of a first conductivity in a semiconductor device, said method comprising:

forming a sub-surface layer of said first conductivity below a surface of said semiconductor device and below said surface wells,

forming diagonally-oriented gap regions in said sub-surface layer, wherein said diagonally-oriented gap regions are oriented diagonally with respect to an orientation of said surface wells;

electrically coupling said sub-surface layer to said surface wells to create a conductive path; and

applying said body-bias voltage to said sub-surface layer.

9. The method as recited in claim 8 wherein said sub-surface layer has an N-type doping.

10. The method as recited in claim 9 wherein said surface wells have an N-type doping.

11. The method as recited in claim 10 wherein each surface well includes a p-type MOSFET (metal oxide semiconductor field effect transistor).

12. The method as recited in claim 8 wherein said sub-surface layer has a P-type doping.

13. The method as recited in claim 12 wherein said surface wells have a P-type doping.

14. The method as recited in claim 13 wherein each surface well includes an n-type MOSFET (metal oxide semiconductor field effect transistor).

15. A method of routing a body-bias voltage to first surface wells of a first conductivity in a semiconductor device, said method comprising:

forming a sub-surface layer of said first conductivity below a surface of said semiconductor device, below said first surface wells, and below second surface wells of a second conductivity

forming gap regions in said sub-surface layer, wherein said gap regions are oriented diagonally with respect to an orientation of said first surface wells without isolating said second surface wells;

electrically coupling said sub-surface layer to said surface wells to create a conductive path; and

applying said body-bias voltage to said sub-surface layer.

16. The method as recited in claim 15 wherein said sub-surface layer has an N-type doping.

17. The method as recited in claim 16 wherein said first surface wells have an N-type doping and wherein said second surface wells have a P-type doping.

18. The method as recited in claim 17 wherein each first surface well includes a p-type MOSFET (metal oxide semiconductor field effect transistor).

19. The method as recited in claim 15 wherein said sub-surface layer has a P-type doping.

20. The method as recited in claim 19 wherein said first surface wells have a P-type doping, wherein said second surface wells have an N-type doping, and wherein each first surface well includes an n-type MOSFET (metal oxide semiconductor field effect transistor).

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2022
From: QUEST PATENT RESEARCH CORPORATION
To: DEEPWELL IP LLC
Reel/Frame 059654/0315 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2022
From: INTELLECTUAL VENTURES ASSETS 174 LLC
To: QUEST PATENT RESEARCH CORPORATION
Reel/Frame 059649/0779 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2022
From: INTELLECTUAL VENTURES HOLDING 81 LLC
To: INTELLECUTAL VENTURES ASSETS 174 LLC
Reel/Frame 058881/0459 →
MERGER Recorded Jul 19, 2021
From: INTELLECTUAL VENTURE FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 056905/0392 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 036711 FRAME: 0160. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 6, 2015
From: INTELLECTUAL VENTURES FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036797/0356 →
MERGER Recorded Sep 29, 2015
From: INTELLECTUAL VENTURE FUNDING LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 036711/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2009
From: TRANSMETA LLC
To: INTELLECTUAL VENTURE FUNDING LLC
Reel/Frame 023268/0771 →
MERGER Recorded Mar 26, 2009
From: TRANSMETA CORPORATION
To: TRANSMETA LLC
Reel/Frame 022454/0522 →