IP Library › Granted Patent US 7,656,709
Granted Patent B2
US 7,656,709 · App. 11/800,002 · Granted Feb 2, 2010

NAND step up voltage switching method

Assignee: Micron Technology, Inc.
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Quick Facts
Patent No.
US 7,656,709
App. No.
11/800,002
Granted
Feb 2, 2010
Kind
B2
Abstract

Methods and memories having switching points for changing Vstep increments according to a level of a multilevel cell being programmed include programming at a smaller Vstep increment in narrow threshold voltage situations and programming at a larger Vstep increment where faster programming is desired.

Claims (60)

1. A method for programming a NAND memory, comprising:

programming at least a first of a plurality of states of a multiple state memory with a first series of programming pulses having a first step-up voltage gap;

changing the gap of the first step-up voltage gap to a second larger gap; and

programming a remaining plurality of states of the multiple state memory with a second series of programming pulses having the second step-up voltage gap;

wherein changing the gap comprises:

determining a switching point for changing the gap by verifying programming of each of the at least a first of the plurality of states, and changing the gap when each of the at least a first of the plurality of states is verified; and

changing the gap at the switching point.

2. The method of claim 1 , wherein programming comprises performing lower page programming and upper page programming, lower page programming setting two levels, and upper page programming programming each of the two levels to two additional levels.

3. The method of claim 2 , wherein lower page programming programs the first two levels using a fixed step-up voltage increment.

4. A NAND memory device, comprising:

an array of non-volatile memory cells having series-coupled strings of non-volatile memory cells; and

circuitry for control and/or access of the array of non-volatile memory cells, the control circuitry adapted to perform a method comprising:

programming at least a first of a plurality of states of a multiple state memory with a first series of programming pulses having a first step-up voltage gap;

changing the gap of the first step-up voltage gap to a second larger gap; and

programming a remaining plurality of states of the multiple state memory with a second series of programming pulses having the second step-up voltage gap.

5. A memory device, comprising:

an array of non-volatile memory cells accessed by bitlines and word lines;

circuitry for control and/or access of the array of non-volatile memory cells, the control circuitry adapted to perform a method comprising:

programming at least a first of a plurality of states of a multiple state memory with a first series of programming pulses having a first step-up voltage gap;

changing the gap of the first step-up voltage gap to a second larger gap; and

programming a remaining plurality of states of the multiple state memory with a second series of programming pulses having the second step-up voltage gap.

6. A processing system, comprising:

a processor; and

a memory device coupled to the processor to store data provided by the processor and to provide data to the processor, the memory comprising:

an array of memory cells arranged in rows and columns and accessed by bitlines and word lines;

address circuitry to latch address signals provided on address input connections; and

circuitry for control and/or access of the array of non-volatile memory cells, the control circuitry adapted to perform a method comprising:

programming at least a first of a plurality of states of a multiple state memory with a first series of programming pulses having a first step-up voltage gap;

changing the gap of the first step-up voltage gap to a second larger gap; and

programming a remaining plurality of states of the multiple state memory with a second series of programming pulses having the second step-up voltage gap.

7. A memory module, comprising:

a plurality of contacts; and

two or more memory devices, each having access lines selectively coupled to the plurality of contacts;

wherein at least one of the memory devices comprises:

an array of non-volatile memory cells arranged in rows and columns and accessed by bitlines and word lines; and

circuitry for control and/or access of the array of non-volatile memory cells, the control circuitry adapted to perform a method comprising:

programming at least a first of a plurality of states of a multiple state memory with a first series of programming pulses having a first step-up voltage gap;

changing the gap of the first step-up voltage gap to a second larger gap; and

programming a remaining plurality of states of the multiple state memory with a second series of programming pulses having the second step-up voltage gap.

8. The method of claim 1 , wherein programming comprises programming cells of the memory to one of four states.

9. The method of claim 8 , wherein programming the remaining plurality of states comprises programming cells that are to be programmed to two of the four states before changing the gap.

10. The method of claim 9 , wherein programming at least a first of the plurality of states comprises programming the remaining two states after changing the gap.

11. The method of claim 1 , wherein programming is started with a voltage less than that of a first of the states to be programmed.

12. A method for programming a memory device, comprising:

programming at least a first of a plurality of states of a multiple state memory with a first series of programming pulses having a first step-up voltage gap;

changing the gap of the first step-up voltage gap to a second larger gap; and

programming a remaining plurality of states of the multiple state memory with a second series of programming pulses having the second step-up voltage gap;

wherein changing the gap comprises:

determining a switching point for changing the gap by verifying programming of each of the at least a first of the plurality of states, and

changing the gap when each of the at least a first of the plurality of states is verified; and

changing the gap at the switching point.

13. The NAND memory device of claim 4 , wherein the control circuitry is further adapted to change the gap to the second larger gap by verifying programming of each of the at least a first of the plurality of states, and changing the gap when each of the at least a first of the plurality of states is verified, and changing the gap at a switching point.

14. The NAND memory device of claim 4 , wherein the control circuitry is further adapted to change the gap to the second larger gap at a switching point determined as part of a trim set for the memory.

15. The NAND memory device of claim 4 , wherein programming at least a first of the plurality of states further comprises performing lower page programming and upper page programming, lower page programming setting two levels, and upper page programming programming each of the two levels to two additional levels.

16. The NAND memory device of claim 15 , wherein lower page programming programs the first two levels using a fixed step-up voltage increment.

17. The NAND memory device of claim 4 , wherein programming is started with a voltage less than that of a first of the states to be programmed.

18. The NAND memory device of claim 5 , wherein the control circuitry is further adapted to change the gap by verifying programming of each of the at least a first of the plurality of states, and changing the gap when each of the at least a first of the plurality of states is verified, and changing the gap at a switching point.

19. The NAND memory device of claim 5 , wherein the control circuitry is further adapted to change the gap to the second larger gap at a switching point determined as part of a trim set for the memory.

20. The NAND memory device of claim 5 , wherein programming at least a first of the plurality of states further comprises performing lower page programming and upper page programming, lower page programming setting two levels, and upper page programming programming each of the two levels to two additional levels.

21. The NAND memory device of claim 20 , wherein lower page programming programs the first two levels using a fixed step-up voltage increment.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2007
From: GODA, AKIRA; KIM, TAEHOON; RIVERS, DOYLE; PORTER, ROGER
To: MICRON TECHNOLOGY, INC.
Reel/Frame 019292/0091 →
Continuity (1)
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