IP Library Granted Patent US 7,799,312
Granted Patent B2
US 7,799,312 · App. 11/806,064 · Granted Sep 21, 2010

Method for manufacturing high-density indium tin oxide target, methods for preparing tin oxide powder and indium oxide powder used therefor

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Quick Facts
Patent No.
US 7,799,312
App. No.
11/806,064
Granted
Sep 21, 2010
Kind
B2
Abstract

A method for manufacturing an indium tin oxide (ITO) target and methods for preparing indium oxide powder (In 2 O 3 ) and tin oxide powder (SnO 2 ). The method for manufacturing an ITO (indium tin oxide) target includes preparing an In 2 O 3 powder having a surface area of about 10-18 m 2 /g and an average particle diameter of between about 40 to 80 nm; preparing a SnO 2 powder having a surface area of about 8-15 m 2 /g and an average particle diameter of about 60-100 nm; molding a mixture of the In 2 O 3 powder and the SnO 2 powder; and sintering the mixture at atmospheric pressure under oxidation atmosphere. The ITO target is applicable for a high-quality, transparent electrode for a display, such as a liquid crystal display, electroluminescent display, or field emission display.

Claims (38)

1. A method of preparing an ITO (indium tin oxide) target, comprising:

preparing an In 2 O 3 powder having a surface area of about 10-18 m 2 /g and an average particle diameter of between about 40 to 80 nm;

preparing a SnO 2 powder having a surface area of about 8-15 m 2 /g and an average particle diameter of about 60-100 nm;

molding a mixture of the In 2 O 3 powder and the SnO 2 powder; and

sintering the mixture at atmospheric pressure under oxidizing atmosphere.

2. The method as claimed in claim 1 , wherein the mixture includes about 80-95% by weight of the In 2 O 3 powder and about 5-20% by weight of the SnO 2 powder.

3. The method as claimed in claim 1 , wherein the ITO target has a sintering density of greater than 7.0 g/cm 3 .

4. The method as claimed in claim 1 , wherein sintering the mixture is performed at a temperature of about 1,200° C. to about 1,600° C.

5. The method as claimed in claim 1 , wherein preparing the In 2 O 3 powder includes:

adding an alkaline precipitant to an indium solution having an indium ion concentration of about 2-5 M at room temperature, wherein the alkaline precipitant is added to the indium solution at a rate of about 0.5 L/min - about 4 L/min, while adjusting a pH of the indium solution to about 6-8 to form a In(OH) 3 precipitate; and

calcining the In(OH) 3 precipitate at a temperature of between about 600° C. to about 1,100° C.

6. The method as claimed in claim 5 , further comprising dissolving metallic indium in acid to form the indium solution.

7. The method as claimed in claim 5 , further comprising dissolving an indium-containing salt in water to form the indium solution.

8. The method as claimed in claim 7 , wherein the indium-containing salt includes InCl 3 and/or In(NO 3 ) 3 .

9. The method as claimed in claim 5 , wherein the alkaline precipitant includes NH 4 OH, NH 3 gas, NaOH, KOH, NH 4 HCO 3 , (NH 4 ) 2 CO 3 or a mixture including at least two of the foregoing materials.

10. The method as claimed in claim 9 , wherein the NH 4 OH is 28 wt % NH 4 OH.

11. The method as claimed in claim 5 , further comprising washing and drying the precipitate before calcining.

12. The method as claimed in claim 1 , wherein preparing the SnO 2 powder includes:

preparing a tin solution by dissolving metallic tin in an acid, the tin solution consisting essentially of tin ions, other ions produced from the dissociation of the acid, molecules of the acid, and water, wherein the tin ions are in a concentration of about 0.5-2 M;

allowing a tin hydroxide precipitate to precipitate from the tin solution at room temperature and aging the precipitate in the tin solution for about 1-24 hours;

separating the precipitate from the tin solution; and

calcining the separated precipitate at a temperature of about 400-900° C. to obtain the SnO 2 powder.

13. The method as claimed in claim 12 , wherein the acid includes nitric acid and/or sulfuric acid.

14. The method as claimed in claim 12 , wherein the structural formula of the precipitate is Sn(OH) 2 and/or Sn(OH) 4 .

15. The method as claimed in claim 12 , further comprising washing and drying the separated precipitate before the calcining.

16. The method as claimed in claim 1 , wherein preparing the SnO 2 powder includes:

preparing a tin solution by dissolving a tin-containing salt in water, the tin solution consisting essentially of tin ions, other ions produced from the dissociation of the salt, and water, wherein the tin ions are in a concentration of about 0.5-2 M;

precipitating a precipitate of tin hydroxide by adding an alkaline precipitant to the tin solution at room temperature at a rate of about 0.5-3 L/min and adjusting the pH to about 3-7, and separating the precipitate from the tin solution; and

calcining the separated precipitate at a temperature of about 400-900° C. to obtain the SnO 2 powder.

17. The method as claimed in claim 16 , wherein the tin-containing salt includes SnF 4 , SnCl 4 , SnI 4 , Sn(C 2 H 3 O 2 ) 2 , SnCl 2 , SnBr 2 , SnI 2 , or a mixture including at least two of the foregoing materials.

18. The method as claimed in claim 16 , wherein the alkaline precipitant includes NH 4 OH, NH 3 gas, NaOH, KOH, NH 4 HCO 3 , (NH 4 ) 2 CO 3 , or a mixture including at least two of the foregoing materials.

19. The method as claimed in claim 18 , wherein the NH 4 OH is 28 wt % NH 4 OH.

20. The method as claimed in claim 16 , further comprising washing and drying the separated precipitate before calcining the precipitate.

21. A method of preparing an ITO (indium tin oxide) target, comprising:

preparing an In 2 O 3 powder having a surface area of about 5-18 m 2 /g and an average particle diameter of between about 40 to 160 nm;

preparing a SnO 2 powder having a surface area of about 4-15 m 2 /g and an average particle diameter of about 50-200 nm;

molding a mixture of the In 2 O 3 powder and the SnO 2 powder; and

sintering the mixture at atmospheric pressure under oxidizing atmosphere.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2022
From: SAMSUNG CORNING ADVANCED GLASS, CO. LTD.
To: KV MATERIALS CO., LTD.
Reel/Frame 059654/0324 →
CHANGE OF NAME Recorded Apr 20, 2022
From: SAMSUNG CORNING ADVANCED GLASS, LLC
To: SAMSUNG CORNING ADVANCED GLASS, CO. LTD.
Reel/Frame 059775/0176 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2014
From: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
To: SAMSUNG CORNING ADVANCED GLASS, LLC
Reel/Frame 032860/0248 →
CHANGE OF NAME Recorded Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE/ASSIGNOR PREVIOUSLY RECORDED ON REEL 020624 FRAME 0240. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
MERGER Recorded Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2007
From: SONG, KYONG-HWA; PARK, SANG-CHEOL; NAM, JUNG-GYU
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 019826/0303 →