Patent Assignment
Reel/Frame 032860/0248
Assignment of Assignor's Interest
Recorded: 2014-05-09
Pages: 3
Assignor
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Executed: 2014-03-26
Assignee
SAMSUNG CORNING ADVANCED GLASS, LLC
212, TANGJEONG-RO, TANGJEONG-MYEON, ASAN-SI, CHUNGCHEONGNAM-DO, 336-725, KOREA, REPUBLIC OF
Covered Properties
(2)
Method for Manufacturing High-Density Indium Tin Oxide Target, Methods for Preparing Tin Oxide Powder and Indium Oxide Powder Used Therefor
Oxide Semiconductor Sputtering Target, Method Of Manufacturing Thin-Film Transistors Using The Same, And Thin Film Transistor Manufactured Using The Same
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 6, 2007
From: SONG, KYONG-HWA; PARK, SANG-CHEOL; NAM, JUNG-GYU
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 019826/0303 →
Merger
Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger.
May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
Change of Name
Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
Assignment of Assignor's Interest
May 30, 2013
From: HA, JINJOO; LEE, SEUNGJU; OH, JOO HYE; CHO, JOHANN
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 030512/0397 →
Assignment of Assignor's Interest
Apr 20, 2022
From: SAMSUNG CORNING ADVANCED GLASS, CO. LTD.
To: KV MATERIALS CO., LTD.
Reel/Frame 059654/0324 →
Change of Name
Apr 20, 2022
From: SAMSUNG CORNING ADVANCED GLASS, LLC
To: SAMSUNG CORNING ADVANCED GLASS, CO. LTD.
Reel/Frame 059775/0176 →