Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
View Patent ↗A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
1. A circuitized substrate comprising:
a first dielectric layer;
a first electrical conductor positioned on said first dielectric layer, said first electrical conductor including an opening therein;
a quantity of resistor material within said opening within said first electrical conductor;
a second dielectric layer positioned substantially over said quantity of resistor material;
a second electrical conductor positioned on said second dielectric layer; and
an electrical connection passed through said second electrical conductor and said quantity of resistor material but not electrically connected to said first electrical conductor, to substantially reduce the capacitance between said first and second electrical conductors and increase the high frequency resistance in said electrical connection between said first and second electrical conductors.
2. The circuitized substrate of claim 1 wherein said first dielectric layer comprises an organic dielectric material selected from the group of polymer material consisting of fiberglass-reinforced epoxy resins, polytetrafluoroethylene, polyimides, polyamides, cyanate resins, polyphenylene ether resins, photo-imageable materials, and combinations thereof.
3. The circuitized substrate of claim 1 wherein said first and second electrical conductors each comprise copper or copper alloy material.
4. The circuitized substrate of claim 1 wherein said quantity of resistor material comprises an epoxy resin material and a quantity of metal particles therein.
5. The resistor material in accordance with claim 4 wherein said resistor material comprises nano-particles.
6. The resistor material in accordance with claim 4 wherein said resistor material comprises micro-particles.
7. The resistor material in accordance with claim 4 , wherein said quantity of metal particles comprises at least one of the group, silver and copper, and wherein the metal:polymer ratio of said resistor material is constant, notwithstanding variable resistance due to a varying silver:copper ratio.
8. The resistor material in accordance with claim 7 , wherein said quantities of silver and copper are selected from the group of ratios represented by the formula: xAg:(50-x)Cu.
9. A circuitized substrate comprising:
a first dielectric layer;
a first electrical conductor positioned on said first dielectric layer, said first electrical conductor including an opening therein;
a second dielectric layer positioned over said first electrical conductor;
a second electrical conductor positioned on said second dielectric layer;
an interim dielectric layer disposed over said first electrical conductor having said opening therein and including a second opening therein;
a quantity of resistor material within said opening of said first electrical conductor and being positioned within said second opening within said interim dielectric layer, said second dielectric layer being positioned directly on said interim dielectric layer and over said quantity of resistor material; and
an electrical connection passed through said second electrical conductor and said quantity of resistor material but not electrically connected to said first electrical conductor, to substantially reduce the capacitance between said first and second electrical conductors and increase the high frequency resistance in said electrical connection between said first and second electrical conductors.
10. The circuitized substrate in accordance with claim 9 wherein said interim dielectric is photo-imageable.