Die offset die to die bonding
A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate.
1. An electronic device comprising;
a body;
a semiconductor die on and supported by the body and having first and second opposite edges which extend beyond respective first and second opposite edges of the body to define a first unsupported portion of the die running from the first edge of the body to the first edge of the die and a second unsupported portion of the die running from the second edge of the body to the second edge of the die;
the first edge of the die extending beyond the first edge of the body to a lesser extent than the second edge of the die extends beyond the second edge of the body.
2. The electronic device of claim 1 and further comprising a plurality of bond pads on the die adjacent the first edge of the die and on a portion of the first unsupported portion of the die.
3. The electronic device of claim 2 wherein the bond pads on the die are on a surface thereof opposite a surface thereof adjacent the body.
4. The electronic device of claim 3 and further comprising a second semiconductor die, the body being a spacer on the second semiconductor die and between the first semiconductor die and the second semiconductor die.
5. The electronic device of claim 4 and further comprising a substrate, the second semiconductor die being on the substrate.
6. The electronic device of claim 5 and further comprising bond pads on the substrate, and wires connecting bond pads on the first semiconductor die with bond pads on the substrate.
7. The device of claim 1 and further comprising said device incorporated in a system.
8. The device of claim 7 wherein the system is selected from the group consisting of a hand-held device, a vehicle, and a computer.