Probe card for inspecting electric properties of an object

1. A probe card for inspecting electric properties of an object to be inspected located thereunder, comprising:

a circuit board; and

an inspection contact structure provided between said circuit board and the object to be inspected, for passing current between the object to be inspected and said circuit board,

said inspection contact structure comprising:

a substrate in a flat plate shape; and

sheets attached to both upper and lower surfaces of said substrate to have the substrate sandwiched therebetween, each of said sheets composed of a plurality of elastic conductive portions and an insulating portion interconnecting said conductive portions,

said conductive portions being formed to pass through each of said sheets and protrude from both upper and lower surfaces of each of said sheets,

said substrate being formed with a plurality of current-carrying paths passing from the upper surface to the lower surface of said substrate,

said conductive portions of said sheets on both surfaces of said substrate being electrically connected to corresponding current-carrying paths of said substrate,

said sheets on both surfaces of said substrate being bonded to said substrate,

said sheet on the upper surface side of said substrate having a frame attached thereto, and

said frame surrounding an outer peripheral portion of said sheet on the upper surface side and holding said sheet on the upper surface side, and said sheet on the upper surface side being bonded to said circuit board by said frame; and

wherein said frame is fixed to said circuit board at a position outside an outer periphery of said substrate.

2. A probe card for inspecting electric properties of an object to be inspected located thereunder, comprising:

a circuit board; and

an inspection contact structure provided between said circuit board and the object to be inspected, for passing current between the object to be inspected and said circuit board,

said inspection contact structure comprising:

a substrate in a flat plate shape; and

a sheet attached to an upper surface of said substrate, said sheet composed of a plurality of elastic conductive portions and an insulating portion interconnecting said conductive portions,

said conductive portions being formed to pass through said sheet and protrude from both upper and lower surfaces of said sheet,

said substrate being formed with a plurality of current-carrying paths passing from the upper surface of said substrate to a lower surface of said substrate,

said conductive portions of said sheet being electrically connected to corresponding current-carrying paths of said substrate,

said sheet being bonded to said substrate, and

said sheet having a frame attached thereto,

said frame surrounding an outer peripheral portion of said sheet and holding said sheet, and said sheet being bonded to said circuit board by said frame; and

wherein said frame is fixed to said circuit board at a position outside an outer periphery of said substrate.

3. The probe card as set forth in claim 2 ,

wherein said inspection contact structure further comprises:

a sheet bonded to the lower surface of said substrate sandwiching said substrate between the sheet bonded to the lower surface of said substrate and said sheet bonded to the upper surface of said substrate, said sheet bonded to the lower surface side being composed of a plurality of elastic conductive portions and an insulating portion interconnecting said conductive portions,

said conductive portions being formed to pass through said sheet bonded to the lower surface of said substrate and protrude from both upper and lower surfaces of said sheet bonded to the lower surface of said substrate, and

said conductive portions of said sheet bonded to the lower surface of said substrate being electrically connected to corresponding current-carrying paths of said substrate.

4. The probe card as set forth in claim 3 ,

wherein said current-carrying paths pass through said substrate in a vertical thickness direction, and

wherein said conductive portions of said sheets on both surfaces of said substrate are in contact with end portions of said respective corresponding current-carrying paths of said substrate in a manner to have said current-carrying paths of said substrate sandwiched therebetween.

5. The probe card as set forth in claim 3 ,

wherein said conductive portions of said sheet on the upper surface side of said substrate are formed to have weaker elasticity than that of said conductive portions of said sheet on the lower surface side of said substrate.

6. The probe card as set forth in claim 2 ,

wherein said frame has a plurality of flexible plate shape members extending to the outside of said substrate, and

wherein outer end portions of said plate shape members are fixed to said circuit board.

7. The probe card as set forth in claim 4 ,

wherein a notch is formed in a side surface in a width direction perpendicular to an outward direction of said plate shape member.

8. The probe card as set forth in claim 4 ,

wherein a hole is formed at an outer end portion of said plate shape member, and said frame is fixed to said circuit board with an adhesive partially entering the hole.

9. The probe card as set forth in claim 2 ,

wherein said frame is fixed to said circuit board with an elastic adhesive.

10. The probe card as set forth in claim 2 ,

wherein said frame is made of a material having a same thermal expansion coefficient as that of the object to be inspected.

11. The probe card as set forth in claim 3 ,

wherein said frame is a first frame, said sheet on the lower surface side of the substrate having a second frame attached thereto, said second frame surrounding an outer peripheral portion of said sheet on the lower surface side and holding said sheet on the lower surface side, and said sheet on the lower surface side being fixed to said substrate by said second frame.

12. The probe card as set forth in claim 3 ,

wherein said second frame is fixed to said substrate with an elastic adhesive.

13. The probe card as set forth in claim 3 ,

wherein said second frame is made of a material having a same thermal expansion coefficient as that of the object to be inspected.

14. The probe card as set forth in claim 2 ,

wherein said substrate is made of a material having a same thermal expansion coefficient as that of the object to be inspected.

15. The probe card as set forth in claim 12 ,

wherein said substrate is a silicon substrate.

16. The probe card as set forth in claim 2 ,

wherein said conductive portions of said sheets on both the upper surface and the lower surface of said substrate and said current-carrying paths of said substrate are arranged on same axes in a vertical direction.

17. The probe card as set forth in claim 2 ,

wherein a metal wiring connecting predetermined current-carrying paths is formed on at least one of the upper surface and the lower surface of said substrate.

18. The probe card as set forth in claim 3 ,

wherein tapered contactors that come into contact with the object to be inspected are attached to tip portions of said conductive portions of said sheet on the lower surface side of said substrate, and

wherein said contactors are held on a holder and fixed to said substrate by said holder.

19. The probe card as set forth in claim 3 ,

wherein said conductive portions of said sheets are brought into a state capable of making electrical continuity when compressed in the vertical direction, and

wherein said sheet on the upper surface side is fixed to said substrate and said circuit board and said sheet on the lower surface side is fixed to said substrate with said conductive portions being in a state incapable of making electrical continuity without being compressed.

20. A probe card for inspecting electric properties of an object to be inspected located thereunder, comprising:

a circuit board; and

an inspection contact structure provided between said circuit board and the object to be inspected, for passing current between the object to be inspected and said circuit board,

said inspection contact structure comprising:

a substrate in a flat plate shape; and

sheets attached to both upper and lower surfaces of said substrate to have the substrate sandwiched therebetween, each of said sheets composed of a plurality of elastic conductive portions and an insulating portion interconnecting said conductive portions,

said conductive portions being formed to pass through each of said sheets and protrude from both upper and lower surfaces of each of said sheets,

said substrate being formed with a plurality of current-carrying paths passing from the upper surface of said substrate to the lower surface of said substrate,

said conductive portions of said sheets on both surfaces of said substrate being electrically connected to corresponding current-carrying paths of said substrate,

said sheets on both surfaces of said substrate being fixed to said substrate, and

said sheet on the upper surface side of said substrate having a frame attached thereto,

said frame surrounding an outer peripheral portion of said sheet and holding said sheet, and said sheet on the upper surface side being fixed to said circuit board by said frame; and

wherein said frame is fixed to said circuit board at a position outside an outer periphery of said substrate,

wherein said frame has a plurality of flexible plate shape members extending to the outside of said substrate, and

wherein outer end portions of said plate shape members are fixed to said circuit board.