IP Library Granted Patent US 7,544,983
Granted Patent B2
US 7,544,983 · App. 11/825,032 · Granted Jun 9, 2009

MTJ read head with sidewall spacers

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Quick Facts
Patent No.
US 7,544,983
App. No.
11/825,032
Granted
Jun 9, 2009
Kind
B2
Abstract

Following CMP, a magnetic tunnel junction stack may protrude through the oxide that surrounds it, making it susceptible to possible shorting to its sidewalls. The present invention overcomes this problem by depositing silicon nitride spacers on these sidewalls prior to oxide deposition and CMP. So, even though the stack may protrude through the top surface of the oxide after CMP, the spacers serve to prevent possible later shorting to the stack.

Claims (16)

1. A magnetic tunnel junction stack having a cap with sidewalls and a top surface, comprising:

a layer of silicon oxide, having a top surface, surrounding said magnetic tunnel junction stack;

said cap protruding a distance above said silicon oxide top surface;

silicon nitride spacers that surround said cap, located between said sidewalls and said silicon oxide layer, said silicon nitride spacers being in contact with both the cap and the silicon oxide;

said silicon nitride spacers having a thickness that increases from zero at said cap top surface to a maximum of about 0.1 microns where it is below said silicon oxide top surface; and

whereby said silicon nitride spacers prevent shorting to said cap layer during operation of said magnetic tunnel junction stack.

2. The magnetic tunnel junction stack described in claim 1 wherein said layer of silicon oxide has a thickness between about 600 and 1,000 Angstroms.

3. The magnetic tunnel junction stack described in claim 1 wherein said cap top surface is between about 200 and 400 Angstroms above said silicon oxide top surface.

4. A magnetic tunnel junction stack having a cap with sidewalls and a top surface, comprising:

a layer of silicon oxide, having a top surface, surrounding said magnetic tunnel junction stack;

said cap protruding a distance above said silicon oxide top surface;

silicon nitride spacers that surround said cap, located between said sidewalls and said silicon oxide layer, said silicon nitride spacers being in contact with all of said sidewalls and with the silicon oxide;

said silicon nitride spacers having a uniform thickness of between about 500 and 1,000 Angstroms; and

whereby said silicon nitride spacers prevent shorting to said cap layer during operation of said magnetic tunnel junction stack.

5. The magnetic tunnel junction stack described in claim 4 wherein said layer of silicon oxide has a thickness between about 600 and 1,000 Angstroms.

6. The magnetic tunnel junction stack described in claim 4 wherein said cap top surface is between about 200 and 400 Angstroms above said silicon oxide top surface.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2018
From: MAGIC TECHNOLOGIES, INC.
To: HEADWAY TECHNOLOGIES, INC.
Reel/Frame 047604/0081 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2018
From: APPLIED SPINTRONICS TECHNOLOGY, INC.
To: MAGIC TECHNOLOGIES, INC.
Reel/Frame 047391/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2018
From: YANG, LIN
To: HEADWAY TECHNOLOGIES, INC.; APPLIED SPINTRONICS, INC.
Reel/Frame 047306/0079 →