Nitride semiconductor lasers and its manufacturing method

1. A nitride semiconductor laser comprising:

an n-type cladding layer, an active layer, a guide layer, a p-type cladding layer, and a p-type contact layer which are all formed over a semiconductor substrate, wherein:

the cross section of the p-type cladding layer partially includes an inverted trapezoidal portion,

a semi-insulating AlGaN layer is buried on both lateral sides of the inverted trapezoidal portion of the p-type cladding layer, and the p-type cladding layer lies over the AlGaN layer continuously with the inverted trapezoidal portion of the p-type cladding layer, and the p-type contact layer lies over the p-type cladding layer,

a mesa stripe as the inverted trapezoidal portion of the p-type cladding layer extends parallel to <1-100>, and a surface orientation of a tilted surface of the AlGaN layer in the inverted trapezoidal portion is (11-22), and the growth direction is in the semiconductor substrate <0001> direction, and

GaN layers lie on the tilted surface, upper surface and lower surface of the AlGaN layer.

2. A method of manufacturing a nitride semiconductor laser comprising the steps of:

(a) forming an n-type cladding layer, an active layer, and a guide layer or a partial p-type cladding layer;

(b) forming a stripe type mask parallel to a <1-100> direction on the guide layer or partial p-type cladding layer;

(c) forming a selectively-grown layer comprised of a semi-insulating layer of a AlGaN layer which has a (11-22) growth plane at both mask edges;

(d) removing the mask after step (c); and

(e) forming a p-type cladding layer on the semi-insulating AlGaN layer and the guide layer or partial p-type cladding layer.

3. The method of manufacturing a nitride semiconductor laser according to claim 2 , wherein the buried layer includes a first and a second buried layer, and a tilted surface of the first buried layer is opposite to a tilted layer of the second buried layer and the distance between the tilted surfaces increases as the distance from a base layer increases, and the sectional shape of the p-type cladding layer portion lying between the tilted surfaces is inverted trapezoidal.

4. The method of manufacturing a nitride semiconductor laser according to claim 2 , wherein metalorganic vapor phase epitaxy is used to form the buried layer.

5. The method of manufacturing a nitride semiconductor laser according to claim 2 , wherein for the AlGaN material, Fe or Ru is used as a semi-insulating dopant and Fe or Ru dopant material is an organic metal.

6. A nitride semiconductor laser comprising:

an n-type cladding layer, an active layer, a guide layer, a p-type cladding layer, and a p-type contact layer which are all formed over a semiconductor substrate,

wherein a cross-section of the p-type cladding layer partially includes an inverted trapezoidal portion,

wherein the inverted trapezoidal portion of the p-type cladding layer has a mesa stripe shape,

wherein a semi-insulating AlGaN layer is buried on both lateral sides of the inverted trapezoidal portion of the p-type cladding layer,

wherein the p-type cladding layer lies over and below the semi-insulating AlGaN layer to cover a surface of the semi-insulating AlGaN layer, and

wherein the p-type contact layer lies over the p-type cladding layer.

7. The nitride semiconductor laser according to claim 6 ,

wherein the inverted trapezoidal portion of the p-type cladding layer extends parallel to <1-100>, and a surface orientation of a tilted surface of the AlGaN layer in the inverted trapezoidal portion is (11-22), and wherein a growth direction of the AlGaN layer is in the semiconductor substrate <0001> direction.

8. The nitride semiconductor laser according to claim 6 , wherein the p-type cladding layer is grown on first and second areas, wherein the first area is the semi-insulating AlGaN layer and the second area is an opening space between adjacent ones of the semi-insulating AlGaN layers, and wherein side growth planes of the semi-insulating AlGaN layer are (11-20) and (11-22) planes.

9. The nitride semiconductor laser according to claim 8 , wherein a surrounding area of the semi-insulating AlGaN layer is covered by GaN layers, wherein the semi-insulating AlGaN layer is on a p-type GaN layer in a lower area of the semi-insulating AlGaN layer, and wherein the semi-insulating AlGaN layer is under a semi-insulating GaN layer in upper and side areas of semi-insulating AlGaN layer.

10. The nitride semiconductor laser according to claim 6 , wherein a relation between the Al composition ratio in the buried semi-insulated AlGaN layer (Al B ) and the Al composition ratio in the p-type cladding layer comprised of AlGaN material, is Al B ≧Al C .

11. The nitride semiconductor laser according to claim 6 , wherein the active region is etched perpendicularly to the growth plane, and a lateral side of the active region is buried by the semi-insulating AlGaN layer.

12. The nitride semiconductor laser according to claim 6 , wherein the semi-insulating AlGaN layer has a resistivity of 1×10 4 Ωcm.

13. The nitride semiconductor laser according to claim 6 , wherein the semi-insulating AlGaN layer has a resistivity of 1×10 7 Ωcm to 1×10 10 Ωcm.

14. The nitride semiconductor laser according to claim 7 ,

wherein the semi-insulating AlGaN layer is on a first GaN layer,

and the top surface and the tilted surface is covered by a second GaN layer.