Junction field effect transistor and method of manufacturing the same
View Patent ↗According to a junction FET of the present invention, the depth of a channel region is made shallow by selectively performing ion implantation and diffusion. Since the channel region forms a pn junction together with a p type semiconductor layer with relatively low impurity concentration, the improvement in the high frequency characteristic and the reduction in the amount of the leakage current because of the reduction in a junction capacitance can be achieved. Moreover, the depth of a gate region is also made shallow by ion implantation, and thus the reduction in noise because of the reduction in the internal resistance can be achieved.
1. A junction field effect transistor comprising:
a semiconductor substrate of a first general conductivity type;
a semiconductor layer of the first general conductivity type disposed on the substrate;
a channel region of a second general conductivity type, the channel region being formed in a surface portion of the semiconductor layer so that a lateral edge of the channel region forms a pn junction with the semiconductor layer;
a source region of the second general conductivity type formed in the channel region;
a drain region of the second general conductivity type formed in the channel region;
a gate region of the first general conductivity type formed in the channel region;
a conductive layer disposed on the gate region so as to be in contact with the gate region and comprising polysilicon containing an impurity; and
an insulating film disposed on the semiconductor layer so as to cover the entire top surface of the conductive layer.
2. The transistor of claim 1 , wherein depths of the source, drain and gate regions in the channel region are substantially equal.
3. A junction field effect transistor comprising:
a semiconductor substrate of a first general conductivity type;
a semiconductor layer of the first general conductivity type disposed on the substrate;
a channel region of a second general conductivity type, the channel region being formed in a surface portion of the semiconductor layer so that a contour of the channel region is within a contour of the semiconductor layer and a lateral edge of the channel region forms a pn junction with the semiconductor layer;
a source region of the second general conductivity type formed in the channel region, an impurity concentration of the source region being higher than an impurity concentration of the channel region;
a drain region of the second general conductivity type formed in the channel region, an impurity concentration of the drain region being higher than the impurity concentration of the channel region;
a gate region of the first general conductivity type formed in the channel region;
a conductive layer disposed on the gate region so as to be in contact with the gate region and comprising polysilicon containing an impurity; and
an insulating film disposed on the semiconductor layer so as to cover the entire top surface of the conductive layer.
4. The transistor of claim 3 , wherein a top portion of the conductive layer is wider than a bottom portion of the conductive layer that is in contact with the gate region.
5. The transistor of claim 3 , wherein depths of the source, drain and gate regions in the channel region are equal.
6. A method of manufacturing a junction field effect transistor, comprising:
forming a semiconductor layer of a first general conductivity type on a semiconductor substrate of the first general conductivity type;
implanting impurity ions in the semiconductor layer to form a channel region of a second general conductivity type so that a lateral edge of the channel region forms a pn junction with the semiconductor layer;
forming a conductive layer on the channel region by depositing polysilicon containing an impurity;
forming a gate region of the first general conductivity type in the channel region;
forming a source region and a drain region that are of the second general conductivity type in the channel region;
forming an insulating film disposed on the semiconductor layer; and
forming a source electrode on the source region and a drain electrode on the drain region,
wherein the insulating film is formed so that the insulating film covers the entire top surface of the conductive layer, and the source and drain electrodes penetrate through the insulating film so as to be exposed at a top surface of the insulating film.
7. A method of manufacturing a junction field effect transistor, comprising:
forming a semiconductor layer of a first general conductivity type on a semiconductor substrate of the first general conductivity type;
implanting impurity ions in an isolated area of the semiconductor layer to form a channel region of a second general conductivity type;
forming a conductive layer on the channel region by depositing polysilicon containing an impurity;
forming a gate region of the first general conductivity type in the channel region;
forming a source region and a drain region that are of the second general conductivity type in the channel region
forming an insulating film disposed on the semiconductor layer; and
forming a source electrode on the source region and a drain electrode on the drain region,
wherein the insulating film is formed so that the insulating film covers the entire top surface of the conductive layer, and the source and drain electrodes penetrate through the insulating film so as to be exposed at a top surface of the insulating film.
8. The method of claim 7 , wherein the formation of the gate region and the formation of the source and drain regions comprise implantation of corresponding impurity ions, and the impurity ions for the gate, source and drain regions are diffused in the same heat treatment.
9. The transistor of claim 1 , wherein in plan view of the transistor the conductive layer extends outside the channel region.
10. The transistor of claim 3 , wherein in plan view of the transistor the conductive layer extends outside the channel region.