IP Library Granted Patent US 7,895,546
Granted Patent B2
US 7,895,546 · App. 11/849,391 · Granted Feb 22, 2011

Statistical design closure

Assignee: LSI Corporation
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Quick Facts
Patent No.
US 7,895,546
App. No.
11/849,391
Granted
Feb 22, 2011
Kind
B2
Abstract

A method of statistical design closure is disclosed. The method generally includes the steps of (A) reading statistical data from a database, the statistical data defining a plurality of chip yield improvements, one of the chip yield improvements in each one of a plurality of design closure categories respectively, the chip yield improvements capturing historically trends based on a plurality of previous projects, (B) calculating a plurality of targets of a current design closure project based on the statistical data, one of the targets in each one of the design closure categories respectively and (C) generating a resource report to a user that indicates a plurality of resources expected to be used the current design closure project.

Claims (36)

1. A method of statistical design closure, comprising the steps of:

(A) reading statistical data from a database, said statistical data defining a plurality of chip yield improvements, one of said chip yield improvements in each one of a plurality of design closure categories respectively;

(B) generating a plurality of targets of a current design closure project suitable to achieve an expected chip yield, said generating of said targets is based on said statistical data and is performed by a computer, one of said targets is defined in each one of said design closure categories respectively, said targets comprising respective percentages of a plurality of goals of said current design closure project to be finished; and

(C) generating a resource report to a user that indicates a plurality of resources expected to be used by said current design closure project.

2. The method according to claim 1 , further comprising the step of:

receiving said goals of said current design closure project from said user, wherein at least one of said goals is defined in each of said design closure categories.

3. The method according to claim 1 , wherein said targets in each of at least two of said design closure categories comprise less than 100 percent of said goals in said at least two design closure categories.

4. The method according to claim 1 , wherein said goals comprise (i) a power consumption goal, (ii) a timing goal, (iii) a routing goal, (iv) an area goal, (v) a headcount goal and (vi) a turn-around-time goal.

5. The method according to claim 1 , further comprising the step of:

receiving said expected chip yield from said user.

6. The method according to claim 1 , further comprising the step of:

generating a yield report to said user indicating if said targets will meet said expected chip yield.

7. The method according to claim 6 , further comprising the step of:

receiving an adjustment to said expected chip yield from said user in response to said yield report indicating that said targets will not meet said expected chip yield.

8. The method according to claim 1 , further comprising the step of:

performing said current design closure project, wherein each of said design closure categories is finished upon achieving said targets respectively.

9. The method according to claim 1 , wherein said design closure categories comprise (i) synthesis, (ii) placement, (iii) routing, (iv) timing, (v) power, (vi) area, (vii) headcount and (viii) turn-around-time.

10. The method according to claim 1 , further comprising a storage medium recording a computer program comprising the steps of claim 1 .

11. A method of statistical design closure, comprising the steps of:

(A) reading statistical data from a database, said statistical data defining a plurality of chip yield improvements, one of said chip yield improvements in each one of a plurality of design closure categories respectively;

(B) receiving an expected chip yield from a user;

(C) generating a plurality of targets of a current design closure project suitable to achieve said expected chip yield, said generating of said targets is based on said statistical data and is performed by a computer, one of said targets is defined in each one of said design closure categories respectively, said targets comprising respective percentages of a plurality of goals of said current design closure project to be finished; and

(D) generating a yield report to said user indicating if said targets will meet said expected chip yield.

12. The method according to claim 11 , further comprising the step of:

receiving said goals of said current design closure project from said user, wherein at least one of said goals is defined in each of said design closure categories.

13. The method according to claim 11 , wherein said targets in each of at least two of said design closure categories comprise less than 100 percent of said goals in said at least two design closure categories.

14. The method according to claim 11 , wherein said goals comprise (i) a power consumption goal, (ii) a timing goal, (iii) a routing goal, (iv) an area goal, (v) a headcount goal and (vi) a turn-around-time goal.

15. The method according to claim 11 , further comprising the step of:

receiving an adjustment to said expected chip yield from said user in response to said yield report indicating that said targets will not meet said expected chip yield.

16. The method according to claim 11 , further comprising the step of:

generating a resource report to said user that indicates a plurality of resources expected to be used by said current design closure project.

17. The method according to claim 16 , wherein said resources comprise staffing of said current design closure project.

18. The method according to claim 11 , further comprising the step of:

performing said current design closure project, wherein each of said design closure categories is finished upon achieving said targets associated with said design closure categories respectively.

19. The method according to claim 11 , wherein said design closure categories comprise (i) synthesis, (ii) placement, (iii) routing, (iv) timing, (v) power, (vi) area, (vii) headcount and (viii) turn-around-time.

20. The method according to claim 11 , further comprising a storage medium recording a computer program comprising the steps of claim 11 .

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2007
From: LAHNER, JUERGEN K.; BALASUBRAMANIAN, BALAMURUGAN; CHATURVEDULA, KAVITHA
To: LSI CORPORATION
Reel/Frame 019776/0587 →
Continuity (1)
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