IP Library Granted Patent US 8,133,529
Granted Patent B2
US 8,133,529 · App. 11/852,698 · Granted Mar 13, 2012

Method of forming a micromagnetic device

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Quick Facts
Patent No.
US 8,133,529
App. No.
11/852,698
Granted
Mar 13, 2012
Kind
B2
Abstract

A method of forming a micromagnetic device including providing a substrate and forming a magnetic core layer over the substrate from a magnetic alloy. The magnetic alloy includes iron, cobalt and phosphorous. A content of the cobalt is in a range of 1.8 to 4.5 atomic percent. A content of the phosphorus is in a range of 20.1 to 30 atomic percent. A content of the iron is substantially a remaining proportion of the magnetic alloy.

Claims (26)

1. A method of forming a micromagnetic device, comprising:

providing a substrate; and

forming a magnetic core layer over said substrate from a magnetic alloy including iron, cobalt, phosphorous and at least one of sulfur, vanadium, tungsten and copper, wherein a content of said at least one of sulfur, vanadium, tungsten and copper is in a range of 1 to 100 parts per million, a content of said cobalt is in a range of 1.8 to 4.5 atomic percent, a content of said phosphorus is in a range of 20.1 to 30 atomic percent, and a content of said iron is substantially a remaining proportion of said magnetic alloy.

2. The method as recited in claim 1 further comprising forming another magnetic core layer over said magnetic core layer.

3. The method as recited in claim 1 wherein said magnetic alloy is an amorphous or nanocrystalline magnetic alloy.

4. The method as recited in claim 1 further comprising forming an insulating layer between said substrate and said magnetic core layer.

5. The method as recited in claim 1 further comprising forming a conductive winding layer and an insulating layer between said substrate and said magnetic core layer.

6. The method as recited in claim 1 further comprising forming an adhesive layer between said substrate and said magnetic core layer.

7. The method as recited in claim 1 further comprising forming a seed layer between said substrate and said magnetic core layer.

8. The method as recited in claim 1 further comprising forming a protective layer over said magnetic core layer.

9. The method as recited in claim 1 further comprising forming an insulating layer over said magnetic core layer.

10. The method as recited in claim 1 further comprising forming an insulating layer and a conductive winding layer over said magnetic core layer.

11. A method of forming a micromagnetic device, comprising:

providing a substrate;

forming a magnetic core layer over said substrate from a magnetic alloy;

forming an insulating layer over said magnetic core layer; and

forming another magnetic core layer over said insulating layer from a magnetic alloy, wherein at least one of said magnetic alloys include iron, cobalt, phosphorous and at least one of sulfur, vanadium, tungsten and copper, wherein a content of said at least one of sulfur, vanadium, tungsten and copper is in a range of 1 to 100 parts per million, a content of said cobalt is in a range of 1.8 to 4.5 atomic percent, a content of said phosphorus is in a range of 20.1 to 30 atomic percent, and a content of said iron is substantially a remaining proportion of said at least one of said magnetic alloys.

12. The method as recited in claim 11 wherein said substrate is formed from a silicon, glass or ceramic material.

13. The method as recited in claim 11 wherein at least one said magnetic alloys is an amorphous or nanocrystalline magnetic alloy.

14. The method as recited in claim 11 further comprising forming a conductive winding layer and another insulating layer between said substrate and said magnetic core layer.

15. The method as recited in claim 11 further comprising forming an adhesive layer and a seed layer between said substrate and said magnetic core layer.

16. The method as recited in claim 11 further comprising forming a protective layer between said magnetic core layer and said insulating layer.

17. The method as recited in claim 11 further comprising forming an adhesive layer and a seed layer between said insulating layer and said another magnetic core layer.

18. The method as recited in claim 11 further comprising forming a protective layer over said another magnetic core layer.

19. The method as recited in claim 11 further comprising forming another insulating layer over said another magnetic core layer.

20. The method as recited in claim 11 further comprising forming another insulating layer and a conductive winding layer over said another magnetic core layer.

Assignments (7)
SECURITY INTEREST Recorded Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2024
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 066353/0886 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2022
From: ALTERA CORPORATION
To: INTEL CORPORATION
Reel/Frame 061159/0694 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2022
From: ENPIRION, INC.
To: ALTERA CORPORATION
Reel/Frame 060390/0187 →
RELEASE OF SECURITY INTEREST Recorded Feb 20, 2009
From: HERCULES TECHNOLOGY II, L.P.
To: ENPIRION, INC.
Reel/Frame 022277/0935 →
SECURITY AGREEMENT Recorded May 27, 2008
From: ENPIRION, INC.
To: HERCULES TECHNOLOGY II, L.P.
Reel/Frame 021029/0674 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2007
From: LOTFI, ASHRAF W.; LIAKOPOULOS, TRIFON M.; FILAS, ROBERT W.
To: ENPIRION, INC.
Reel/Frame 020165/0625 →