Integrated circuit package system for chip on lead
View Patent ↗An integrated circuit package system includes providing an integrated circuit die having planar dimensions; forming a lead extended across one of the planar dimensions of the integrated circuit die; and applying an adhesive layer over the lead of a side opposite the integrated circuit die.
1. An integrated circuit package system comprising:
providing an integrated circuit die having planar dimensions;
forming leads extended across one of the planar dimensions of the integrated circuit die; and
applying an adhesive layer over the leads of a side opposite the integrated circuit die, the adhesive layer directly bonded to the integrated circuit die.
2. The system as claim 1 wherein forming the lead includes forming the lead extended across a die surface length or a die surface width.
3. The system as claimed in claim 1 wherein applying the adhesive layer includes providing the integrated circuit die cantilevered.
4. The system as claimed in claim 1 wherein applying the adhesive layer includes applying an adhesive tape.
5. The system as claimed in claim 1 wherein applying the adhesive layer includes applying a solder.
6. An integrated circuit package system comprising:
providing an integrated circuit die having a die surface length and a die surface width;
forming leads including a long lead extended across the die surface length or the die surface width;
applying an adhesive layer over the leads of a side opposite the integrated circuit die, the adhesive layer directly bonded to the integrated circuit die; and
attaching electrical connectors to the leads and the integrated circuit die mounted over the leads and the adhesive layer.
7. The system as claimed in claim 6 wherein forming the lead includes forming the lead having a length greater than the die surface length or the die surface width.
8. The system as claimed in claim 6 wherein applying the adhesive layer includes providing the integrated circuit die cantilevered or spaced to the leads.
9. The system as claimed in claim 6 wherein applying the adhesive layer includes applying an adhesive tape having an adhesive layer extension.
10. The system as claimed in claim 6 wherein applying the adhesive layer includes applying a solder individually over the long lead.
11. An integrated circuit package system comprising:
an integrated circuit die having planar dimensions;
leads extended across one of the planar dimensions of the integrated circuit die; and
an adhesive layer over the leads of a side opposite the integrated circuit die, the adhesive layer directly bonded to the integrated circuit die.
12. The system as claimed in claim 11 wherein the lead is extended across the die surface length or the die surface width.
13. The system as claimed in claim 11 wherein the adhesive layer includes the integrated circuit die cantilevered.
14. The system as claimed in claim 11 wherein the adhesive layer is an adhesive tape.
15. The system as claimed in claim 11 wherein the adhesive layer is a solder.
16. The system as claimed in claim 11 wherein:
the integrated circuit die has a die surface length and a die surface width;
the lead is leads including a long lead extended across the die surface length or the die surface width;
the adhesive layer is over the leads of a side opposite the integrated circuit die; and
further comprising:
electrical connectors attached to the leads and the integrated circuit die mounted over the leads and the adhesive layer.
17. The system as claimed in claim 16 wherein the lead has a length greater than the die surface length or the die surface width.
18. The system as claimed in claim 16 wherein the adhesive layer includes the integrated circuit die cantilevered or spaced to the leads.
19. The system as claimed in claim 16 wherein the adhesive layer is an adhesive tape having an adhesive layer extension.
20. The system as claimed in claim 16 wherein the adhesive layer is a solder applied individually over the long lead.