IP Library Granted Patent US 7,696,504
Granted Patent B2
US 7,696,504 · App. 11/857,707 · Granted Apr 13, 2010

Phase change memory device

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Quick Facts
Patent No.
US 7,696,504
App. No.
11/857,707
Granted
Apr 13, 2010
Kind
B2
Abstract

A phase change memory device comprises an insulating layer and a phase change layer formed on the insulating layer. A phase change layer has a pad portion. The pad portion is formed with at least one slit.

Claims (12)

1. A phase change memory device comprising an insulating layer and a phase change layer formed on the insulating layer,

the phase change layer having a pad portion,

the pad portion being provided with at least one slit.

2. A phase change memory device as claimed in claim 1 , wherein

the pad portion has a periphery portion and a center portion, the center portion being surrounded by the periphery portion, the at least one slit is formed on the center portion.

3. A phase change memory device as claimed in claim 2 , wherein

the center portion has an outline of a circular shape, a size of the outline being not larger than the pad portion.

4. A phase change memory device as claimed in claim 1 , further comprising a metal layer formed on the phase change layer, the metal layer being provided with at least one additional slit communicating with the slit of the phase change layer.

5. A phase change memory device as claimed in claim 1 , wherein an adhesive layer is provided between the insulating layer and the phase change layer.

6. A phase change memory device as claimed in claim 1 , further comprising a metal layer formed on the phase change layer, the phase change layer having a thermal expansion rate which is larger than that of the metal layer and of the insulating layer.

7. A phase change memory device as claimed in claim 1 , wherein the at least one slit comprises at least one first slit extending in a first direction and at least one second slit extending in a second direction perpendicular to the first direction.

8. A phase change memory device as claimed in claim 7 , wherein the first slit and the second slit are coupled with each other.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2014
From: ELPIDA MEMORY, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 032645/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2007
From: KAWAGOE, TSUYOSHI
To: ELPIDA MEMORY, INC.
Reel/Frame 019851/0535 →