Semiconductor device
View Patent ↗Provided is a semiconductor device in which a plurality of chips are packaged without increasing the thickness of the package. A plurality of semiconductor elements (a first and a second semiconductor elements) that are packaged in the semiconductor device are overlaid with each other. Specifically, the first semiconductor element is fixed on the top surface of the first island while the second semiconductor element is fixed on the bottom surface of the second island. Furthermore, each of the islands (a first and a second islands) on which the semiconductor elements are respectively mounted in the present invention provides a structure has an irregular shape, and the islands are overlaid with each other along the sides of the semiconductor element to be mounted.
1. A semiconductor device comprising:
a plurality of semiconductor elements stacked on one another; and
leads electrically connected with the semiconductor elements, wherein parts of the leads are exposed out of the semiconductor device;
a first island having a first main surface as a top surface and a second main surface as a bottom surface;
a first lead having an end disposed at a position close to the first island;
a first semiconductor element of the plurality of semiconductor elements, the first semiconductor element being fixed on the first main surface of the first island, wherein the first semiconductor element is electrically connected with the first lead;
a second island having a first main surface as a bottom surface and a second main surface as a top surface;
a second lead having an end disposed at a position close to the second island;
a second semiconductor element of the plurality of semiconductor elements, the second semiconductor element being fixed on the first main surface of the second island, wherein the second semiconductor element is electrically connected with the second lead,
wherein a portion of the first semiconductor element extends over an edge of the first island and overlaps the second island, a portion of the second semiconductor element extends over an edge of the second island and overlaps the first island, the second main surface of the first island is unattached to an opposing surface of the second semiconductor element, the second main surface of the second island is unattached to an opposing surface of the first semiconductor element, and a gap between the first island and the second semiconductor element and a gap between the second island and the first semiconductor element are filled with an encapsulating resin,
wherein a first side surface of the first island overlaps a first side surface of the second island, when viewed from a first side surface of the semiconductor device, and
a second side surface of the first island overlaps a second side surface of the second island when viewed from a second side surface of the semiconductor device, the second side surface of the semiconductor device being orthogonal to the first side surface of the semiconductor device; and
electrodes on main surfaces of the two semiconductor elements,
wherein each of the electrodes on the two semiconductor elements is within an area corresponding to the first island or the second island providing support for the semiconductor element on which the electrode is disposed.
2. The semiconductor device according to claim 1 wherein each of the first and the second islands has a triangular shape.
3. The semiconductor device according to claim 1 wherein the first and the second islands have identical shapes and are arranged symmetrically to each other within a plane.
4. The semiconductor device according to claim 1 wherein the first and the second islands are positioned so as to be shifted from each other in a thickness direction of the semiconductor device.
5. The semiconductor device according to claim 1 wherein a third side surface of the first island and a third side surface of the second island are overlaid with each other when viewed from a longer-side surface of the first and the second semiconductor elements.
6. The semiconductor device of claim 1 wherein a third side surface of the first island and a third side surface of the second island are overlaid, at least partially, with each other when viewed from a third side surface of the semiconductor device.
7. The semiconductor device according to claim 1 wherein each of the first and the second islands has a comb shape.
8. The semiconductor device according to claim 1 wherein each of the first and the second islands has a crank shape.
9. The semiconductor device according to claim 1 wherein the opposing surface of the second semiconductor element is a bottom surface of the second semiconductor element and the opposing surface of the first semiconductor element is a bottom surface of the first semiconductor element.