Semiconductor device and method of manufacturing the same
View Patent ↗The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a device element and a pad electrode on its front surface is prepared. The semiconductor substrate is then selectively etched from its back surface to form an opening. A second insulation film is then formed covering the side and back surfaces of the semiconductor substrate. First and second insulation films on the bottom of the opening are then selectively removed to expose a portion of the pad electrode. A wiring layer is then formed along the side surface of the semiconductor substrate, being electrically connected with the exposed pad electrode. An electrode connect layer is then formed covering the wiring layer. A protection layer is then formed covering the back surface of the semiconductor substrate and having an opening in a region for formation of a sidewall electrode. Then, the sidewall electrode is formed in a region exposed by the opening of the protection layer.
1. A semiconductor device comprising:
a semiconductor substrate comprising a front surface, a back surface and a side surface;
a device element formed on the front surface;
a pad electrode disposed on the front surface and electrically connected to the device element;
an insulation film covering the side surface and the back surface;
a wiring layer disposed on the side surface and electrically connected to the pad electrode;
a sidewall electrode disposed on the side surface so as to be electrically connected to the pad electrode through the wiring layer; and
a protection layer disposed on the back surface,
wherein the sidewall electrode is exposed along the side surface and accommodated in an opening formed in the protection layer.
2. The semiconductor device of claim 1 , further comprising an electrode connect layer disposed between the sidewall electrode and the wiring layer, the electrode connect layer covering the wiring layer and electrically connecting the sidewall electrode and the wiring layer.
3. The semiconductor device of claim l, further comprising a supporting body disposed on the front surface.
4. The semiconductor device of claim 1 , wherein the wiring layer extends so as to cover a portion of the back surface.