IP Library Granted Patent US 7,622,791
Granted Patent B2
US 7,622,791 · App. 11/892,382 · Granted Nov 24, 2009

III-V group nitride system semiconductor substrate

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Quick Facts
Patent No.
US 7,622,791
App. No.
11/892,382
Granted
Nov 24, 2009
Kind
B2
Abstract

A III-V group nitride system semiconductor substrate is of a III-V group nitride system single crystal. The III-V group nitride system semiconductor substrate has a flat surface, and a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region inside or outside the plane of the substrate.

Claims (29)

1. A III-V group nitride system semiconductor substrate, comprising a III-V group nitride system single crystal,

wherein:

a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region outside the substrate; and

the III-V group nitride system semiconductor substrate surface comprises a flat surface.

2. The III-V group nitride system semiconductor substrate according to claim 1 , wherein:

the substrate comprises a self-standing substrate consisting of the III-V group nitride system single crystal.

3. The III-V group nitride system semiconductor substrate according to claim 1 , wherein:

the III-V group nitride system single crystal is of hexagonal system.

4. The III-V group nitride system semiconductor substrate according to claim 1 , wherein:

the III-V group nitride system single crystal is of hexagonal system and the low index surface comprises a C-face.

5. The III-V group nitride system semiconductor substrate according to claim 1 , wherein:

the III-V group nitride system single crystal is of hexagonal system and the low index surface comprises a III-group C-face.

6. The III-V group nitride system semiconductor substrate according to claim 1 , wherein:

the III-V group nitride system single crystal is of hexagonal system and the low index surface comprises an A-face, M-face or R-face.

7. The III-V group nitride system semiconductor substrate according to claim 1 , wherein:

the substrate comprises a surface mirror-finished by polishing.

8. A method of making a III-V group nitride system semiconductor substrate, comprising a III-V group nitride system single crystal, wherein: a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region outside the substrate; and the III-V group nitride system semiconductor substrate surface comprises a flat surface, comprising:

hetero-epitaxially growing the III-V group nitride system single crystal on a hetero-substrate; and

subsequently removing the hetero-substrate to obtain the III-V group nitride system semiconductor substrate.

9. A method of making a III-V group nitride system semiconductor substrate, comprising a III-V group nitride system single crystal, wherein: a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region outside the substrate; and the III-V group nitride system semiconductor substrate comprises a flat surface; comprising:

polishing an upper surface of a substrate, the upper surface being of a III-V group nitride system single crystal and being concave upward-bowed, thereby obtaining the III-V group nitride system semiconductor substrate.

10. A III-V group nitride system semiconductor substrate, comprising:

a first III-V group nitride system semiconductor substrate, comprising a III-V group nitride system single crystal, wherein: a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region outside the substrate; and the first III-V group nitride system semiconductor substrate surface comprises a flat surface; and

a crystal layer that is formed on the first III-V group nitride system semiconductor substrate, and comprises a layer represented by Al x Ga 1-x N (0<x≦1).

11. A III-V group nitride system semiconductor device, comprising:

a III-V group nitride system semiconductor substrate, comprising a III-V group nitride system single crystal, wherein: a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region outside the substrate; and the III-V group nitride system semiconductor substrate surface comprises a flat surface; and

a plurality of crystal layers that are formed on the III-V group nitride system semiconductor substrate, and comprise a layer represented by Al x Ga 1-x N (0<x≦1).

12. A lot of LIT-V group nitride system semiconductor substrate, comprising a plurality of III-V group nitride system semiconductor substrates,

wherein: each of the plurality of III-V group nitride system semiconductor substrates comprises a III-V group nitride system single crystal, wherein: a vector made by projecting on a surface of the substrate a normal vector of a low index surface closest to the substrate surface at an arbitrary point in a plane of the substrate is converged on a specific point or a specific region outside the substrate; and the each III-V group nitride system semiconductor substrate surface comprises a flat surface.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →
COMPANY SPLIT Recorded Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
MERGER AND CHANGE OF NAME Recorded Dec 15, 2014
From: HITACHI CABLE, LTD.; HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034630/0897 →