Method for production of silicon carbide layer, gallium nitride semiconductor device and silicon substrate
View Patent ↗A method for producing a silicon carbide layer on a surface of a silicon substrate includes the step of irradiating the surface of the silicon substrate heated in a high vacuum at a temperature in a range of from 500° C. to 1050° C. with a hydrocarbon-based gas as well as an electron beam to form a cubic silicon carbide layer on the silicon substrate surface.
1. A method for producing a silicon carbide layer on a surface of a silicon substrate, comprising the step of:
while irradiating the surface of the silicon substrate heated in high vacuum at a temperature in a range of from 500° C. to 1050° C. with a hydrocarbon-based gas, irradiating the entire surface of the silicon substrate with an electron beam at an angle between 10° and 45° to form a cubic silicon carbide layer on the silicon substrate surface.
2. The method according to claim 1 , wherein angles of irradiating with the hydrocarbon-based gas and electron beam differ from each other.
3. The method according to claim 2 , wherein the angle of irradiating with the hydrocarbon-based gas is larger than the angle of irradiating with the electron beam in terms of an angle of elevation relative to the surface of the silicon substrate.
4. The method according to claim 1 , wherein the electron energy beam has an acceleration energy in a range of from 150 eV to 500 eV and a density in a range of from 1×10 11 electrons·cm −2 to 5×10 13 electrons·cm −2 .