Semiconductor device
View Patent ↗Provided is a semiconductor device that can reduce the resistance in a horizontal direction of a substrate. A current path in a horizontal direction of a substrate is formed in a direction along a short side of the substrate (chip). For example, adopted is a layout in which an element region on an input terminal side and a current extraction region on an output terminal side are aligned along the short side of the chip. Furthermore, a first bump electrode and a second bump electrode, which are respectively connected to the input terminal and the output terminal, are arranged along the short side of the chip. Thus, the current path in the substrate in the horizontal direction in the substrate is formed to have a wide width and a short length. Accordingly, the resistance of the substrate in the horizontal direction is reduced.
1. A semiconductor device comprising:
a rectangular semiconductor substrate;
a discrete semiconductor element disposed on a first portion of a first primary plane of the rectangular semiconductor substrate;
a first electrode disposed on the first portion of the first primary plane; and
a second electrode disposed on a second portion of the first primary plane,
wherein the device is configured to form a current path comprising a first path from the first electrode to a first part of the substrate below the first electrode, a second path from the first part to a second part of the substrate below the second electrode, and a third path from the second part of the substrate to the second electrode, and
the second path is parallel to a short side of the rectangular semiconductor substrate.
2. The semiconductor device of claim 1 , further comprising a first contact hole connecting the first electrode and the first portion of the first primary plane and a second contact hole connecting the second electrode and the second portion of the first primary plane, wherein the first contact hole and the second contact hole are disposed parallel to the short side.
3. The semiconductor device of claim 1 , further comprising a first bump electrode disposed on the first electrode and a second bump electrode disposed on the second electrode.
4. The semiconductor device of claim 3 , wherein the first and second bump electrodes are disposed parallel to the short side.
5. The semiconductor device of claim 1 , further comprising a circuit board on which the rectangular semiconductor substrate is mounted d by a flip chip mounting.
6. A semiconductor device comprising:
a rectangular semiconductor substrate comprising two long sides and two short sides;
an elongated input electrode disposed on a first surface of the substrate along one of the long sides of the substrate so that a direction of the elongation of the input electrode is parallel to the long sides; and
an output electrode disposed on the first surface of the substrate between the elongated input electrode and another of the long sides of the substrate,
wherein the rectangular semiconductor substrate comprises a high impurity substrate and a low impurity layer formed on the high impurity substrate,
the input electrode and the output electrode are electrically connected through the high impurity substrate,
a length of the output electrode in the direction of the elongation of the input electrode is smaller than a length of the input electrode in the direction of the elongation of the input electrode.
7. The semiconductor device of claim 1 , wherein no discrete semiconductor element is disposed on the second portion of the first primary plane.
8. The semiconductor device of claim 1 , wherein the second electrode is smaller than the first electrode.
9. The semiconductor device of claim 6 , wherein the length of the output electrode in the direction of the elongation of the input electrode is smaller than half of the length of the input electrode in the direction of the elongation of the input electrode.