A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.
1. A circuit device comprising:
a circuit board;
conductive patterns formed on an upper surface of the circuit board;
circuit elements electrically connected to the conductive patterns;
leads which are electrically connected to the circuit elements, and which are drawn out to the outside; and
sealing resin covering the circuit elements, the circuit board and the conductive patterns,
wherein
a semiconductor element is mounted on an upper surface of a land part formed of a part of the lead,
a lower surface of the land part is spaced apart from the upper surface of the circuit board,
the sealing resin is made of an insulating material and fills a space between the land part and the circuit board; and
wherein the sealing resin fills the entire space between the land part and the circuit board and insulates the land part and the circuit board.
2. The circuit device according to claim 1 , wherein electrodes provided on an upper surface of the semiconductor element mounted on the land part are connected to pads formed of the conductive patterns through thin metal wires.
3. The circuit device according to claim 1 , wherein the conductive patterns are extended on the circuit board in a region below the land part.
4. The circuit device according to claim 1 , wherein the circuit element is disposed on the circuit board in a region below the land part.
5. The circuit device according to claim 1 , wherein at least a part of the conductive patterns is provided and covered with a resin film and the land part is mounted on an upper surface of the resin film.
6. The circuit device according to claim 1 , wherein
the conductive patterns are formed on an upper surface of an insulating layer which covers the upper surface of the circuit board,
a sealing resin is formed so as to cover the circuit elements and the conductive patterns, and
the insulating layer contains more fillers than the sealing resin.
7. The circuit device according to claim 1 , wherein the semiconductor element which is mounted on the land part is a control element.
8. The circuit device according to claim 1 , further comprising a second land part and a power transistor mounted on the second land part, wherein a lower surface of the second land part is attached to the upper surface of the circuit board.
9. The circuit device according to claim 1 , wherein the circuit elements include an active element.
10. The circuit device according to claim 1 , wherein the circuit elements include a passive element.
11. The circuit device according to claim 1 , wherein the circuit elements include a transistor.
12. The circuit device according to claim 1 , wherein the circuit elements include a chip.