Integrated circuit including doped semiconductor line having conductive cladding

1. An integrated circuit comprising:

a semiconductor substrate;

an array of memory cells;

a doped semiconductor line formed in the semiconductor substrate, the doped semiconductor line coupled to a row of memory cells and directly contacting the semiconductor substrate; and

conductive cladding directly contacting the doped semiconductor line.

2. The integrated circuit of claim 1 , wherein the doped semiconductor line comprises doped Si.

3. The integrated circuit of claim 1 , wherein the conductive cladding contacts a first sidewall of the doped semiconductor line.

4. The integrated circuit of claim 3 , wherein the conductive cladding contacts an entire length of the doped semiconductor line.

5. The integrated circuit of claim 3 , wherein the conductive cladding contacts a second sidewall of the doped semiconductor line.

6. The integrated circuit of claim 5 , wherein the conductive cladding contacts a first portion of a bottom of the doped semiconductor line and a second portion of the bottom of the doped semiconductor line.

7. The integrated circuit of claim 1 , wherein the conductive cladding comprises one of C, TiN, a silicide, and a gas immersion laser doped material.

8. An integrated circuit comprising:

a doped Si line;

conductive cladding directly contacting a first sidewall and a second sidewall of the doped Si line;

a semiconductor substrate directly contacting a bottom of the doped Si line; and

an active device contacting the doped Si line.

9. The integrated circuit of claim 8 , wherein the active device comprises a diode.

10. The integrated circuit of claim 8 , wherein the active device comprises a transistor including a source or drain region contacting the doped Si line.

11. The integrated circuit of claim 8 , further comprising:

a resistivity changing material coupled to the active device.

12. The integrated circuit of claim 11 , wherein the resistivity changing material comprises one of phase change material and magnetic material.

13. An integrated circuit comprising:

a semiconductor substrate;

an array of memory cells;

a doped semiconductor line formed in the semiconductor substrate, the doped semiconductor line coupled to a row of memory cells, and a bottom of the doped semiconductor line directly contacting the semiconductor substrate;

first conductive cladding directly contacting a first sidewall of the doped semiconductor line; and

second conductive cladding directly contacting a second sidewall of the doped semiconductor line opposite the first sidewall, the second conductive cladding not directly contacting the first conductive cladding.

14. The integrated circuit of claim 13 , wherein the first conductive cladding contacts only a portion of the first sidewall, and

wherein the second conductive cladding contacts only a portion of the second sidewall.

15. The integrated circuit of claim 13 , wherein the doped semiconductor line comprises a third sidewall perpendicular to the first sidewall and a fourth sidewall parallel to the first sidewall, the third sidewall intersecting the first sidewall, and the fourth sidewall intersecting the third sidewall, and

wherein the first conductive cladding contacts the third sidewall.

16. The integrated circuit of claim 15 , wherein a sidewall of the first conductive cladding is aligned with the fourth sidewall of the doped semiconductor line.

17. The integrated circuit of claim 15 , wherein the doped semiconductor line comprises a fifth sidewall perpendicular to the fourth sidewall and a sixth sidewall parallel to the fourth sidewall, the fifth sidewall intersecting the fourth sidewall, and the sixth sidewall intersecting the fifth sidewall, and

wherein the first conductive cladding contacts the fourth sidewall and the fifth sidewall.

18. The integrated circuit of claim 17 , wherein a sidewall of the first conductive cladding is aligned with the sixth sidewall of the doped semiconductor line.

19. The integrated circuit of claim 13 , wherein the first conductive cladding comprises one of C, TiN, a silicide, and a gas immersion laser doped material, and

wherein the second conductive cladding comprises one of C, TiN, a silicide, and a gas immersion laser doped material.

20. An integrated circuit comprising:

a doped Si line;

first conductive cladding directly contacting a first sidewall of the doped Si line;

second conductive cladding directly contacting a second sidewall of the doped Si line, the second conductive cladding not directly contacting the first conductive cladding;

a semiconductor substrate directly contacting a bottom of the doped Si line; and

a diode or transistor directly contacting the doped Si line.

21. The integrated circuit of claim 20 , wherein the first conductive cladding contacts only a portion of the first sidewall, and

wherein the second conductive cladding contacts only a portion of the second sidewall.

22. The integrated circuit of claim 20 , wherein the doped Si line comprises a third sidewall perpendicular to the first sidewall and a fourth sidewall parallel to the first sidewall, the third sidewall intersecting the first sidewall, and the fourth sidewall intersecting the third sidewall, and

wherein the first conductive cladding contacts the third sidewall.

23. The integrated circuit of claim 22 , wherein a sidewall of the first conductive cladding is aligned with the fourth sidewall of the doped Si line.

24. The integrated circuit of claim 22 , wherein the doped Si line comprises a fifth sidewall perpendicular to the fourth sidewall and a sixth sidewall parallel to the fourth sidewall, the fifth sidewall intersecting the fourth sidewall, and the sixth sidewall intersecting the fifth sidewall, and

wherein the first conductive cladding contacts the fourth sidewall and the fifth sidewall.

25. The integrated circuit of claim 24 , wherein a sidewall of the first conductive cladding is aligned with the sixth sidewall of the doped Si line.