Integrated circuit package system with dual connectivity
View Patent ↗An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.
1. A method of manufacture of an integrated circuit package system comprising:
forming a lead having a top contact portion, a bottom contact portion, a first inner vertical portion, and a second inner vertical portion, with the first inner vertical portion and the second inner vertical portion both extending from the top contact portion, and the first inner vertical portion and the top contact portion having an angle different than the angle between the second inner vertical portion and the top contact portion;
connecting an integrated circuit die and the lead; and
forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die including:
partially exposing the top contact portion at the top side, and
exposing the bottom contact portion below and away from the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.
2. The method as claimed in claim 1 wherein connecting the integrated circuit die and the lead includes connecting the integrated circuit die and the top contact portion.
3. The method as claimed in claim 1 wherein:
forming the lead includes:
forming an internal contact portion with the top contact portion between the bottom contact portion and the internal contact portion; and
connecting the integrated circuit die and the lead includes:
forming the integrated circuit die and the internal contact portion.
4. The method as claimed in claim 1 wherein:
forming the lead includes:
forming an internal contact portion between the top contact portion and the bottom contact portion; and
connecting the integrated circuit die and the lead includes:
forming the integrated circuit die and the internal contact portion.
5. The method as claimed in claim 1 wherein:
forming the lead includes:
forming a die-attach paddle; and
further comprising:
mounting the integrated circuit die to the die-attach paddle.
6. A method of manufacture of an integrated circuit package system comprising:
forming a die-attach paddle and a lead having a top contact portion, a bottom contact portion, a first inner vertical portion, and a second inner vertical portion, with the first inner vertical portion and the second inner vertical portion both extending from the top contact portion, and the first inner vertical portion and the top contact portion having an angle different than the angle between the second inner vertical portion and the top contact portion;
mounting an integrated circuit die to the die-attach paddle;
connecting the integrated circuit die and the lead; and
forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die including:
partially exposing the top contact portion at the top side, and
exposing the bottom contact portion below and away from the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.
7. The method as claimed in claim 6 further comprising mounting a device over the top contact portion.
8. The method as claimed in claim 6 wherein forming the package encapsulation includes partially exposing the die-attach paddle.
9. The method as claimed in claim 6 wherein:
forming the lead includes:
forming an internal contact portion with the top contact portion between the bottom contact portion and the internal contact portion;
connecting the integrated circuit die and the lead includes:
forming the integrated circuit die and the internal contact portion; and
forming the package encapsulation includes:
covering the internal contact portion.
10. The method as claimed in claim 6 wherein:
forming the lead includes:
forming an internal contact portion between the top contact portion and the bottom contact portion;
connecting the integrated circuit die and the lead includes:
forming the integrated circuit die and the internal contact portion; and
forming the package encapsulation includes:
exposing the internal contact portion from the nonhorizontal portion.
11. An integrated circuit package system comprising:
a lead having a top contact portion, a bottom contact portion, a first inner vertical portion, and a second inner vertical portion, with the first inner vertical portion and the second inner vertical portion both extending from the top contact portion, and the first inner vertical portion and the top contact portion having an angle different than the angle between the second inner vertical portion and the top contact portion;
an integrated circuit die connected with the lead; and
a package encapsulation, having a top side and a bottom side, over the integrated circuit die including:
the top contact portion partially exposed at the top side, and
the bottom contact portion exposed below and away from the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.
12. The system as claimed in claim 11 wherein:
the lead includes an internal contact portion with the top contact portion between the bottom contact portion and the internal contact portion; and
the integrated circuit die is connected with the internal contact portion.
13. The system as claimed in claim 11 wherein:
the lead includes an internal contact portion between the top contact portion and the bottom contact portion; and
the integrated circuit die is connected with the internal contact portion.
14. The system as claimed in claim 11 further comprising a die-attach paddle and the integrated circuit die mounted thereto.
15. The system as claimed in claim 11 further comprising:
a die-attach paddle and the integrated circuit die mounted thereto; and
an internal interconnect between the integrated circuit die and the lead.
16. The system as claimed in claim 15 further comprising a device over the top contact portion.
17. The system as claimed in claim 15 wherein the package encapsulation partially exposes the die-attach paddle.
18. The system as claimed in claim 15 wherein:
the lead includes an internal contact portion with the top contact portion between the bottom contact portion and the internal contact portion;
the integrated circuit die is connected with the internal contact portion; and
the package encapsulation covers the internal contact portion.