IP Library Granted Patent US 7,986,962
Granted Patent B2
US 7,986,962 · App. 11/941,115 · Granted Jul 26, 2011

Providing a high-speed connection between a memory medium of a mobile device and an external device

Assignee: Standard Microsystems Corporation
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Quick Facts
Patent No.
US 7,986,962
App. No.
11/941,115
Granted
Jul 26, 2011
Kind
B2
Abstract

System and method for providing a high speed connection to a memory medium of a mobile device. The mobile device may be a mobile phone or other type of portable electronic device. The memory medium may be removable and/or may be flash memory, as desired. The mobile device may include a USB hub that provides a direct high speed connection between an external device and a memory medium of the mobile device. The USB hub may also provide a connection (possibly high speed) between the external device and the processor of the mobile device. The mobile device may also include a high speed connection between the processor of the mobile device and the memory medium.

Claims (20)

1. A system that is configured to be incorporated in a mobile device, comprising:

a first port that is configured to couple to an external computing device, wherein the first port comprises a universal serial bus (USB) port;

a second port that is configured to couple to a memory medium comprised in the mobile device;

a third port that is configured to couple to a processor comprised in the mobile device;

a USB hub coupled to the first port, the second port, and the third port, wherein the USB hub is configured to provide a connection between the first port and the second port during transfer of data between the external computing device and the memory medium, and wherein the processor of the mobile device is not required for transfer of data between the external computing device and the memory medium.

2. The system of claim 1 , wherein the USB hub is configured to provide a high speed USB connection between the external computing device and the memory medium.

3. The system of claim 1 , wherein the third port is configured to use a first set of registers of a UTMI (USB Transceiver Macrocell Interface) low pin interface (ULPI) to communicate with the external computing device, and wherein the third port is configured to use a second set of registers of the ULPI to communicate with the memory medium.

4. The system of claim 1 , wherein the memory medium of the mobile device is a removable memory medium.

5. The system of claim 1 , wherein the USB hub is configured to provide a high speed connection between the first port and the third port.

6. The system of claim 1 , wherein the mobile device comprises a mobile phone.

7. A system configured to be incorporated in a mobile device, comprising:

a first port configured to couple to an external computing device;

a second port configured to couple to a memory medium of the mobile device;

first logic coupled to the first port, wherein the first logic is configured to provide a universal serial bus (USB) connection between the first port and the second port during transfer of data between the external computing device and the memory medium; and

a third port configured to couple to a processor of the mobile device, wherein the third port is configured to provide a USB high speed digital interface for the processor.

8. The system of claim 7 , wherein the USB high speed digital interface for the processor comprises a UTMI (USB Transceiver Macrocell Interface) low pin interface (ULPI).

9. The system of claim 8 , wherein the third port is configured to use a first set of registers of a ULPI to communicate with the external computing device, and wherein the third port is configured to use a second set of registers of the ULPI to communicate with the memory medium.

10. The system of claim 7 , wherein the first logic comprises a USB hub, wherein the USB hub is coupled to the first, second and third ports.

11. The system of claim 7 , wherein the memory medium is a removable memory medium.

12. The system of claim 7 , wherein the mobile device comprises a mobile phone.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
MERGER Recorded Dec 11, 2017
From: STANDARD MICROSYSTEMS CORPORATION
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 044824/0608 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2009
From: WURZBURG, HENRY; MONKS, MORGAN H.
To: STANDARD MICROSYSTEMS CORPORATION
Reel/Frame 023598/0454 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2008
From: LIANG, WAYNE; ATCHISON, MARK C.
To: STANDARD MICROSYSTEMS CORPORATION
Reel/Frame 020348/0229 →
Continuity (1)
Related Publication 20090131036A1 · May 21, 2009