Multi-chip package semiconductor device
View Patent ↗An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.
1. A multi-chip package semiconductor device comprising:
a driver chip having analog circuits; and
a logic chip having digital circuits;
wherein the driver chip and the logic chip are provided within the same package; and
wherein the driver chip comprises:
a motor drive circuit for driving a motor in accordance with a signal obtained by the logic chip;
a logic chip power supply circuit structured to create a logic chip power supply dedicated for said logic chip;
and a logic chip power supply output terminal structured to output said logic chip power supply; and
wherein the logic chip comprises a circuit operating by receiving power supply from said logic chip power supply circuit via power supply input terminal;
the motor drive circuit, the logic power supply circuit and the logic power supply output terminal are integrated on a same semiconductor substrate of the driver chip; and
the digital circuits are integrated on a semiconductor substrate of the logic chip.
2. A semiconductor device according to claim 1 , wherein:
said logic chip power supply circuit of said driver chip is a power supply circuit utilizing a band gap constant voltage.
3. A semiconductor device according to claim 1 , wherein:
the logic chip power supply is a voltage which is lower than an operating power supply for the driver chip.
4. A semiconductor device according to claim 1 , wherein:
the driver chip comprises an input/output cell circuit, and
the logic chip power supply is a voltage which is lower than an operating power supply for the input/output cell circuit, the operating power supply being externally supplied.
5. A semiconductor device according to claim 1 , wherein:
said motor drive circuit, a part thereof using at least a bipolar device, comprising a vibration detection analog circuit and a vibration correction analog circuit for anti-shake control in equipment in which the semiconductor device is installed;
said logic chip comprises digital circuits for creating a correction signal by obtaining a vibration amount on the basis of a vibration detection signal; and
the created correction signal is supplied to said vibration correction analog circuit of said driver chip.
6. A semiconductor device according to claim 5 , wherein:
the equipment in which the semiconductor device is installed is image pickup equipment.
7. A semiconductor device according to claim 6 , wherein:
an optical lens of the image pickup equipment is controlled based on a control signal supplied from the vibration correction analog circuit.
8. A semiconductor device according to claim 6 , wherein:
an imaging device of the image pickup equipment is controlled based on a control signal supplied from the vibration correction analog circuit.
9. A semiconductor device according to claim 5 , wherein:
said logic chip power supply circuit of said driver chip is a power supply circuit utilizing a band gap constant voltage.
10. A multi-chip package semiconductor device comprising:
a driver chip having analog circuits; and
a logic chip having digital circuits;
wherein the driver chip and the logic chip are provided within the same package; and
wherein the driver chip comprises:
a motor drive circuit for driving a motor in accordance with a signal obtained by the logic chip;
a logic chip power supply circuit structured to create a logic chip power supply for said logic chip;
and a logic chip power supply output terminal structured to output said logic chip power supply; and
wherein the logic chip comprises a circuit operating by receiving power supply from said logic chip power supply circuit via a power supply input terminal;
the motor drive circuit, the logic power supply circuit and the logic power supply output terminal are integrated on a same semiconductor substrate of the driver chip; and
the digital circuits are integrated on a semiconductor substrate of the logic chip.