IP Library Granted Patent US 7,696,807
Granted Patent B2
US 7,696,807 · App. 11/946,525 · Granted Apr 13, 2010

Semiconductor integrated circuit with input buffer having high voltage protection

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Quick Facts
Patent No.
US 7,696,807
App. No.
11/946,525
Granted
Apr 13, 2010
Kind
B2
Abstract

A high voltage reception terminal is formed in a semiconductor integrated circuit without increasing the number of manufacturing processes and the manufacturing cost. A transfer gate configured from a NMOS, which is the high withstand voltage transistor, and a pull-up resistor are formed. An input terminal of the transfer gate is connected to the high voltage reception terminal and an output terminal of the transfer gate is connected to a CMOS inverter through an input resistor. One end of the pull-up resistor is connected to the output terminal of the transfer gate and the other end of the pull-up resistor receives source voltage VDD (5V). The transfer gate lowers the inputted high voltage VX (VX>VDD) to VDD-Vt1′. The pull-up resistor biases the voltage at the output terminal of the transfer gate to VDD and boosts the voltage at the output terminal that has been lowered by the transfer gate to about VDD.

Claims (19)

1. A semiconductor integrated circuit comprising:

a high voltage reception terminal receiving a negative high voltage lower than a ground voltage;

a transfer gate comprising a first MOS transistor of an P channel type withstanding the negative high voltage, the first MOS transistor comprising an input terminal electrically connected to the high voltage reception terminal and a gate receiving the ground voltage;

an input buffer comprising a second MOS transistor comprising a gate electrically connected to an output terminal of the first MOS transistor; and

a pull-down device electrically connected to the output terminal of the first MOS transistor and biasing the output terminal to the ground voltage,

wherein the high voltage reception terminal and the transfer gate are connected directly so that no transistor intersects a current path between the high voltage reception terminal and the transfer gate.

2. The semiconductor integrated circuit of claim 1 , further comprising an output transistor comprising a third MOS transistor of a P channel type withstanding the negative high voltage and electrically connected to the high voltage reception terminal.

3. A semiconductor integrated circuit comprising:

a high voltage reception terminal receiving a positive high voltage higher than a power source voltage;

a transfer gate comprising a first MOS transistor of an N channel type withstanding the positive high voltage, the first MOS transistor comprising an input terminal electrically connected to the high voltage reception terminal and a gate receiving the power source voltage;

an input buffer comprising a second MOS transistor comprising a gate electrically connected to an output terminal of the first MOS transistor; and

a pull-up device electrically connected to the output terminal of the first MOS transistor and biasing the output terminal to the power source voltage,

wherein a resistance of the pull-up device is sufficiently higher than a resistance of the transfer gate that a voltage at the output terminal of the first MOS transistor becomes substantially a ground voltage when the ground voltage is applied to the high voltage reception terminal.

4. A semiconductor integrated circuit comprising:

a high voltage reception terminal receiving a negative high voltage lower than a ground voltage;

a transfer gate comprising a first MOS transistor of an P channel type withstanding the negative high voltage, the first MOS transistor comprising an input terminal electrically connected to the high voltage reception terminal and a gate receiving the ground voltage;

an input buffer comprising a second MOS transistor comprising a gate electrically connected to an output terminal of the first MOS transistor; and

a pull-down device electrically connected to the output terminal of the first MOS transistor and biasing the output terminal to the ground voltage,

wherein a resistance of the pull-down device is sufficiently higher than a resistance of the transfer gate that a voltage at the output terminal of the first MOS transistor becomes substantially a power source voltage when the power source voltage is applied to the high voltage reception terminal.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 033813 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 21, 2015
From: SYSTEM SOLUTIONS CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034816/0510 →
CHANGE OF NAME Recorded Dec 3, 2014
From: SANYO SEMICONDUCTOR CO., LTD
To: SYSTEM SOLUTIONS CO., LTD.
Reel/Frame 034537/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033813/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT #12/577882 PREVIOUSLY RECORDED ON REEL 026594 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2011
From: SANYO ELECTRIC CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 026594/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2008
From: TAKAHASHI, SHUICHI
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 020565/0503 →