IP Library Granted Patent US 7,542,349
Granted Patent B2
US 7,542,349 · App. 11/946,674 · Granted Jun 2, 2009

Semiconductor memory device

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Quick Facts
Patent No.
US 7,542,349
App. No.
11/946,674
Granted
Jun 2, 2009
Kind
B2
Abstract

The invention provides a semiconductor memory device where a circuit area is minimized and a voltage drop in a high voltage supply path to a source line is reduced. An output of a high voltage generation circuit is connected to a source line through a first transfer gate, and connected to a word line through a second transfer gate. The first transfer gate is configured of a P-channel type MOS transistor of which on and off are controlled by a write enable signal, and the second transfer gate is configured of a P-channel type MOS transistor of which on and off are controlled by an erase enable signal. A third transfer gate supplying the output of the high voltage generation circuit to the source line without through a high voltage switching circuit is further provided. The third transfer gate is configured of a P-channel type MOS transistor and an inverted output of the high voltage switching circuit is applied to the gate thereof.

Claims (12)

1. A semiconductor memory device comprising:

a plurality of nonvolatile memory cell transistors that are electrically data erasable and writable;

a source line connected to sources of the nonvolatile memory cell transistors;

a word line connected to control gates of the nonvolatile memory cell transistors;

a high voltage generation circuit generating a high voltage for erasing and writing data;

a high voltage switching circuit switching in response to a selection signal and outputting the high voltage generated by the high voltage generation circuit;

a first switch outputting the high voltage outputted by the high voltage switching circuit to the source line in response to a write enable signal;

a second switch outputting the high voltage outputted by the high voltage switching circuit to the word line in response to an erase enable signal; and

a third switch outputting the high voltage generated by the high voltage generation circuit to the source line bypassing the high voltage switching circuit in response to the write enable signal.

2. The semiconductor memory device of claim 1 , wherein the high voltage switching circuit comprises a latch circuit set in response to the selection signal and receives the high voltage generated by the high voltage generation circuit as a supply voltage.

3. The semiconductor memory device of claim 1 , wherein each of the first switch, the second switch and the third switch operates as a transfer gate.

4. The semiconductor memory device of claim 1 , wherein each of the nonvolatile memory cell transistors comprises a source, a drain, a floating gate formed on a portion of a channel with a gate insulation film being interposed therebetween, an insulation film formed on the floating gate, a tunnel insulation film formed covering a side surface of the floating gate and the insulation film, and a control gate formed on the tunnel insulation film and a portion of the channel.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 033813 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 21, 2015
From: SYSTEM SOLUTIONS CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034816/0510 →
CHANGE OF NAME Recorded Dec 3, 2014
From: SANYO SEMICONDUCTOR CO., LTD
To: SYSTEM SOLUTIONS CO., LTD.
Reel/Frame 034537/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033813/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT #12/577882 PREVIOUSLY RECORDED ON REEL 026594 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →