Semiconductor device manufacturing apparatus and method
View Patent ↗A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses the polished surface of the semiconductor wafer against the polishing pad together with the retainer ring to polish the semiconductor wafer. The retainer ring used in the present invention has a surface that is in contact with the polishing pad, which increases a contact area of the retainer ring against the polishing pad in accordance with wear of the retainer ring.
1. A semiconductor device manufacturing apparatus comprising:
a head for holding a semiconductor wafer,
a retainer ring for surrounding the outer periphery of the semiconductor wafer held by said head, and
a polishing pad for polishing a polished surface of the semiconductor wafer,
the semiconductor device manufacturing apparatus pressing the polished surface of the semiconductor wafer against said polishing pad together with said retainer ring to polish the semiconductor wafer,
wherein:
concentric grooves which differ in depth or a plurality of holes which differ in depth are formed in a surface of said retainer ring that is in contact with said polishing pad.
2. A semiconductor device manufacturing method using a polishing apparatus comprising a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by said head, and a polishing pad for polishing a polished surface of the semiconductor wafer, wherein concentric grooves which differ in depth or a plurality of holes which differ in depth are formed in a surface of said retainer ring that is in contact with said polishing pad, the semiconductor device manufacturing apparatus pressing the polished surface of the semiconductor wafer onto said polishing pad together with said retainer ring to polish the semiconductor wafer, said method comprising:
adjusting an effective pressure of said retainer ring by eliminating, step by step, the plurality of said grooves or holes in accordance with wear that occurs on said retainer ring, when polishing the semiconductor wafer.
3. The semiconductor device manufacturing apparatus according to claim 1 , wherein
said concentric grooves which differ in depth are formed such that the depth of each successive groove becomes shallower toward an outer peripheral edge portion of said retainer ring.
4. The semiconductor device manufacturing apparatus according to claim 1 , wherein
the bottom of said grooves and holes have a curved surface.
5. A semiconductor device manufacturing apparatus comprising:
a head for holding a semiconductor wafer,
a retainer ring for surrounding the outer periphery of the semiconductor wafer held by said head, and
a polishing pad for polishing a polished surface of the semiconductor wafer,
the semiconductor device manufacturing apparatus pressing the polished surface of the semiconductor wafer against said polishing pad together with said retainer ring to polish the semiconductor wafer,
wherein
concentric grooves each having a tapered surface or a plurality of holes each having a tapered surface are formed in a surface of said retainer ring that is in contact with said polishing pad, and
wherein
each of said concentric grooves having the tapered surface differ in depth, and the concentric grooves are formed such that the depth of each successive groove becomes shallower toward an outer peripheral edge portion of said retainer ring.
6. A semiconductor device manufacturing apparatus comprising:
a head for holding a semiconductor wafer,
a retainer ring for surrounding the outer periphery of the semiconductor wafer held by said head, and
a polishing pad for polishing a polished surface of the semiconductor wafer,
the semiconductor device manufacturing apparatus pressing the polished surface of the semiconductor wafer against said polishing pad together with said retainer ring to polish the semiconductor wafer,
wherein
concentric grooves each having a tapered surface or a plurality of holes each having a tapered surface are formed in a surface of said retainer ring that is in contact with said polishing pad, and
wherein
the bottom of said grooves and holes have a curved surface.