Semiconductor device and manufacturing method thereof
View Patent ↗A semiconductor device includes an N-channel transistor having an N-type gate electrode and a P-channel transistor having a P-type gate electrode which are formed on a semiconductor substrate. The P-type gate electrode includes a first silicon layer formed as the lowest layer, and doped with a P-type impurity; a second silicon layer formed on the first silicon layer; and a metal containing layer formed on the second silicon layer. The N-type gate electrode includes a third silicon layer formed as the lowest layer and doped with an N-type impurity; a fourth silicon layer formed on the third silicon layer; and a metal containing layer formed on the fourth silicon layer. At least one of the second silicon layer and the fourth silicon layer is doped with no impurity or an impurity of a conductive type opposite to that of the impurity in a corresponding one of the first silicon layer and third silicon layer.
1. A semiconductor device comprising:
an N-channel transistor having an N-type gate electrode and a P-channel transistor having a P-type gate electrode which are formed on a semiconductor substrate,
wherein said P-type gate electrode comprises:
a first silicon layer formed as the lowest layer, and doped with a P-type impurity;
a second silicon layer formed on said first silicon layer; and
a first metal containing layer formed on said second silicon layer,
wherein said N-type gate electrode comprises:
a third silicon layer formed as the lowest layer and doped with an N-type impurity;
a fourth silicon layer formed on said third silicon layer; and
a second metal containing layer formed on said fourth silicon layer,
wherein at least one of said second silicon layer and said fourth silicon layer is doped with no impurity or an impurity of a conductive type opposite to that of the impurity in a corresponding one of said first silicon layer and said third silicon layer, and
wherein said at least one of said second silicon layer and said fourth silicon layer is configured to substantially prevent said impurity in said corresponding one of said first silicon layer and said third silicon layer from diffusing toward said corresponding one of said first metal containing layer and said second metal containing layer.
2. The semiconductor device according to claim 1 , wherein said first metal containing layer and said second metal containing layer each comprise:
a metal silicide layer;
a metal nitride layer formed on said metal silicide layer; and
a metal layer formed on said metal nitride layer, and
said metal silicide layer is formed for silicon grains to be dispersedly and discontinuously arranged.
3. The semiconductor device according to claim 2 , further comprising:
a fifth silicon layer and a sixth silicon layer formed between said corresponding metal silicide layer and said corresponding metal nitride layer of said first metal containing layer and said second metal containing layer, respectively,
wherein silicon grains of said fifth silicon layer and said sixth silicon layer are continuously arranged.
4. The semiconductor device according to claim 1 , wherein said metal is a refractory metal selected from the group consisting of Co, Ti, W, Ni, Mo, and Ta.
5. The semiconductor device according to claim 1 , wherein said second silicon layer and said fourth silicon layer are doped with impurities of conductive types opposite to that of the impurities in said first silicon layer and said third silicon layer, respectively.
6. A semiconductor device comprising:
a gate electrode formed on a gate insulating film, which is formed on a semiconductor substrate,
wherein said gate electrode comprises:
a silicon layer formed in contact with said gate insulating film; and
a metal containing layer formed on said silicon layer,
said silicon layer comprises:
a first silicon layer provided on said gate insulating film and doped with an impurity of a first conductive type; and
a second silicon layer formed on said first silicon layer and doped with no impurity or an impurity of a second conductive type opposite to the first conductive type,
wherein said second silicon layer is configured to substantially prevent said impurity of said first conductive type from diffusing toward said metal containing layer.
7. The semiconductor device according to claim 6 , wherein said metal containing layer comprises:
a metal silicide layer formed on said second silicon layer;
a metal nitride layer formed on said metal silicide layer; and
a metal layer formed on said metal nitride layer.
8. The semiconductor device according to claim 6 , wherein said metal is at least one refractory metal selected from the group consisting of Co, Ti, W, Ni, Mo, and Ta.
9. The semiconductor device according to claim 8 , wherein a metal contained in said metal is tungsten (W).
10. The semiconductor device according to claim 6 , wherein an impurity of the second conductive type is doped into said second silicon layer.
11. The semiconductor device according to claim 6 , wherein the first conductive type is a P-type, and boron (B) is doped into said first silicon layer.
12. The semiconductor device according to claim 1 , wherein a thickness of said at least one of said second silicon layer and said fourth silicon layer is in a range from 5 nm to 20 nm.
13. The semiconductor device according to claim 6 , wherein a thickness of said second silicon layer is in a range from 5 nm to 20 nm.
14. A semiconductor device comprising:
an N-channel transistor having an N-type gate electrode and a P-channel transistor having a P-type gate electrode which are formed on a semiconductor substrate,
wherein said P-type gate electrode comprises:
a first silicon layer formed as the lowest layer, and doped with a P-type impurity;
a second silicon layer formed on said first silicon layer; and
a metal containing layer formed on said second silicon layer,
wherein said N-type gate electrode comprises:
a third silicon layer formed as the lowest layer and doped with an N-type impurity;
a fourth silicon layer formed on said third silicon layer; and
a metal containing layer formed on said fourth silicon layer,
wherein at least one of said second silicon layer and said fourth silicon layer is doped with no impurity or an impurity of a conductive type opposite to that of the impurity in a corresponding one of said first silicon layer and third silicon layer,
wherein said metal containing layer comprises:
a metal suicide layer;
a metal nitride layer formed on said metal silicide layer; and
a metal layer formed on said metal nitride layer, and
wherein said metal silicide layer is formed for silicon grains to be dispersedly and discontinuously arranged.
15. The semiconductor device according to claim 14 , further comprising:
a fifth silicon layer formed between said metal silicide layer and said metal nitride layer, wherein silicon grains of said fifth silicon layer are continuously arranged.
16. A semiconductor device comprising a gate electrode formed on a semiconductor substrate through a gate insulating film,
wherein said gate electrode comprises:
a silicon layer formed in contact with said gate insulating film; and
a metal containing layer formed on said silicon layer,
said silicon layer comprises:
a first silicon layer provided on said gate insulating film and doped with an impurity of a first conductive type; and
a second silicon layer formed on said first silicon layer and doped with no impurity or an impurity of a second conductive type opposite to the first conductive type,
wherein said metal containing layer comprises:
a metal silicide layer formed on said second silicon layer;
a metal nitride layer formed on said metal silicide layer; and
a metal layer formed on said metal nitride layer.
17. The semiconductor device according to claim 16 , wherein the first conductive type is a P-type, and boron (B) is doped into said first silicon layer.